Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12308299 | TEC-embedded dummy die to cool the bottom die edge hotspot | Chia-Pin Chiu, Peng Li, Deepak Goyal | 2025-05-20 |
| 12266589 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2025-04-01 |
| 12205793 | Method and apparatus for anisotropic pattern etching and treatment | Seokmin Yun, Shuogang Huang, Mark Merrill | 2025-01-21 |
| 12191220 | Hybrid interposer of glass and silicon to reduce thermal crosstalk | Chandra Mohan Jha, Je-Young Chang, Chia-Pin Chiu | 2025-01-07 |
| 12170182 | Ribbon beam angle adjustment in an ion implantation system | Chi-Ming Huang, Shao-Yu HU | 2024-12-17 |
| 12094800 | Thermally conductive slugs/active dies to improve cooling of stacked bottom dies | Jin Yang, Chia-Pin Chiu, Peng Li, Deepak Goyal | 2024-09-17 |
| 12057369 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2024-08-06 |
| 12046536 | Integrated heat spreader with enhanced vapor chamber for multichip packages | Je-Young Chang, James C. Matayabas, Jr., Kyle Arrington | 2024-07-23 |
| 11901262 | Cooling solution including microchannel arrays and methods of forming the same | Nicholas Neal, Shankar Devasenathipathy, Je-Young Chang | 2024-02-13 |
| 11894282 | Vented lids for integrated circuit packages | Sergio Antonio Chan Arguedas, Peng Li, Chandra Mohan Jha, Aravindha R. Antoniswamy, Cheng Xu +2 more | 2024-02-06 |
| 11854935 | Enhanced base die heat path using through-silicon vias | Weston BERTRAND, Kyle Arrington, Shankar Devasenathipathy, Aaron McCann, Nicholas Neal | 2023-12-26 |
| 11854931 | STIM/liquid metal filled laser drill trench to improve cooling of stacked bottom die | Chia-Pin Chiu, Peng Li, Shankar Devasenathipathy | 2023-12-26 |
| 11837519 | Heatsink cutout and insulating through silicon vias to cut thermal cross-talk | Chia-Pin Chiu, Chandra Mohan Jha | 2023-12-05 |
| 11670561 | 3D buildup of thermally conductive layers to resolve die height differences | Chandra Mohan Jha, Je-Young Chang, Chia-Pin Chiu, Liwei Wang | 2023-06-06 |
| 11646244 | Socket loading mechanism for passive or active socket and package cooling | Steven A. Klein, Chia-Pin Chiu, Shankar Devasenathipathy | 2023-05-09 |
| 11626395 | Thermal spreading management of 3D stacked integrated circuits | Robert L. Sankman, Pooya Tadayon, Weihua Tang, Chandra Mohan Jha | 2023-04-11 |
| 11581671 | Integrated circuit package socket housing to enhance package cooling | Steven A. Klein, Chia-Pin Chiu, Shankar Devasenathipathy | 2023-02-14 |
| 11521914 | Microelectronic assemblies having a cooling channel | Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Ying Wang, Yikang Deng, Chong Zhang +3 more | 2022-10-25 |
| 11456232 | Thermal assemblies for multi-chip packages | Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang, Shankar Devasenathipathy | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |