| 12482779 |
Hybrid backside thermal structures for enhanced ic packages |
Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2025-11-25 |
|
| 12341281 |
Micro socket electrical couplings for dies |
Srikant Nekkanty, Debendra Mallik, Saikumar Jayaraman, Feroz Mohammad |
2025-06-24 |
|
| 12136577 |
Integrated circuit die packages including a contiguous heat spreader |
Feras Eid, Paul Diglio |
2024-11-05 |
$48,202,000 |
| 12135460 |
Stackable photonics die with direct optical interconnect |
Todd Coons, Michael Rutigliano, Abram M. Detofsky |
2024-11-05 |
$48,202,000 |
| 12087658 |
Hybrid thermal interface material (TIM) with reduced 3D thermal resistance |
Pooya Tadayon |
2024-09-10 |
$16,964,000 |
| 12080620 |
Additively manufactured structures for heat dissipation from integrated circuit devices |
Feras Eid, Xavier Francois Brun, Paul Diglio, Sergio Antonio Chan Arguedas |
2024-09-03 |
$14,017,000 |
| 12061230 |
Active optical plug to optically or electrically test a photonics package |
Todd Coons, Michael Rutigliano, Abram M. Detofsky |
2024-08-13 |
$26,861,000 |
| 12009612 |
Dual-sided socket device with corrugation structures and shield structures |
Srikant Nekkanty, Steven A. Klein, Feroz Mohammad, Kuang Liu, Zhichao Zhang |
2024-06-11 |
$21,221,000 |
| 11948906 |
Hybrid backside thermal structures for enhanced IC packages |
Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala |
2024-04-02 |
$34,819,000 |
| 11935860 |
Electrical connector with insulated conductive layer |
Morten S. Jensen, Michael E. Ryan, Srikant Nekkanty |
2024-03-19 |
$28,784,000 |
| 11656247 |
Micro-coaxial wire interconnect architecture |
Ronald Michael Kirby, Erkan Acar, Youngseok Oh, Justin Huttula, Mohanraj Prabhugoud |
2023-05-23 |
$11,397,000 |
| 11639556 |
Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays |
Pooya Tadayon, Andrew Hoitink, Tanner Schulz |
2023-05-02 |
$21,235,000 |
| 11592472 |
Thermal switch for rapid thermal coupling and decoupling of devices under test |
James Hastings, Morten S. Jensen, Todd Coons |
2023-02-28 |
$10,430,000 |
| 11581237 |
Cooling apparatuses for microelectronic assemblies |
Pooya Tadayon |
2023-02-14 |
$12,790,000 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Chandra Mohan Jha, Weihua Tang +2 more |
2022-07-26 |
$27,041,000 |
| 11372023 |
Slip-plane MEMs probe for high-density and fine pitch interconnects |
Pooya Tadayon |
2022-06-28 |
$15,065,000 |
| 11249113 |
High density and fine pitch interconnect structures in an electric test apparatus |
Pooya Tadayon, Mark Bohr |
2022-02-15 |
$14,138,000 |
| 11073538 |
Electrical testing apparatus with lateral movement of a probe support substrate |
Paul Diglio |
2021-07-27 |
$27,337,000 |
| 10935573 |
Slip-plane MEMS probe for high-density and fine pitch interconnects |
Pooya Tadayon |
2021-03-02 |
$34,569,000 |
| 10877068 |
High density and fine pitch interconnect structures in an electric test apparatus |
Pooya Tadayon, Mark Bohr |
2020-12-29 |
$24,597,000 |
| 10644458 |
Shielded interconnect array |
Youngseok Oh, Justin Huttula, Mohanraj Prabhugoud, Ronald Michael Kirby, Erkan Acar |
2020-05-05 |
$29,615,000 |
| 10566263 |
Conformable heat spreader |
John C. Johnson |
2020-02-18 |
$23,634,000 |
| 10488438 |
High density and fine pitch interconnect structures in an electric test apparatus |
Pooya Tadayon, Mark Bohr |
2019-11-26 |
$25,149,000 |
| 10338099 |
Low profile edge clamp socket |
Christopher Del Barga, Ronald Michael Kirby |
2019-07-02 |
$19,690,000 |
| 10324112 |
Package testing system and method with contact alignment |
Mohanraj Prabhugoud, Andrew Hoitink, Abram M. Detofsky |
2019-06-18 |
$21,210,000 |
