Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341281 | Micro socket electrical couplings for dies | Srikant Nekkanty, Debendra Mallik, Saikumar Jayaraman, Feroz Mohammad | 2025-06-24 |
| 12135460 | Stackable photonics die with direct optical interconnect | Todd Coons, Michael Rutigliano, Abram M. Detofsky | 2024-11-05 |
| 12136577 | Integrated circuit die packages including a contiguous heat spreader | Feras Eid, Paul Diglio | 2024-11-05 |
| 12087658 | Hybrid thermal interface material (TIM) with reduced 3D thermal resistance | Pooya Tadayon | 2024-09-10 |
| 12080620 | Additively manufactured structures for heat dissipation from integrated circuit devices | Feras Eid, Xavier Francois Brun, Paul Diglio, Sergio Antonio Chan Arguedas | 2024-09-03 |
| 12061230 | Active optical plug to optically or electrically test a photonics package | Todd Coons, Michael Rutigliano, Abram M. Detofsky | 2024-08-13 |
| 12009612 | Dual-sided socket device with corrugation structures and shield structures | Srikant Nekkanty, Steven A. Klein, Feroz Mohammad, Kuang Liu, Zhichao Zhang | 2024-06-11 |
| 11948906 | Hybrid backside thermal structures for enhanced IC packages | Feras Eid, Weihua Tang, Akhilesh Rallabandi, Marco Aurelio Cartas Ayala | 2024-04-02 |
| 11935860 | Electrical connector with insulated conductive layer | Morten S. Jensen, Michael E. Ryan, Srikant Nekkanty | 2024-03-19 |
| 11656247 | Micro-coaxial wire interconnect architecture | Ronald Michael Kirby, Erkan Acar, Youngseok Oh, Justin Huttula, Mohanraj Prabhugoud | 2023-05-23 |
| 11639556 | Massively-parallel micronozzle array for direct write electrodeposition of high-density microstructure arrays | Pooya Tadayon, Andrew Hoitink, Tanner Schulz | 2023-05-02 |
| 11592472 | Thermal switch for rapid thermal coupling and decoupling of devices under test | James Hastings, Morten S. Jensen, Todd Coons | 2023-02-28 |
| 11581237 | Cooling apparatuses for microelectronic assemblies | Pooya Tadayon | 2023-02-14 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11372023 | Slip-plane MEMs probe for high-density and fine pitch interconnects | Pooya Tadayon | 2022-06-28 |
| 11249113 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2022-02-15 |
| 11073538 | Electrical testing apparatus with lateral movement of a probe support substrate | Paul Diglio | 2021-07-27 |
| 10935573 | Slip-plane MEMS probe for high-density and fine pitch interconnects | Pooya Tadayon | 2021-03-02 |
| 10877068 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2020-12-29 |
| 10644458 | Shielded interconnect array | Youngseok Oh, Justin Huttula, Mohanraj Prabhugoud, Ronald Michael Kirby, Erkan Acar | 2020-05-05 |
| 10566263 | Conformable heat spreader | John C. Johnson | 2020-02-18 |
| 10488438 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2019-11-26 |
| 10338099 | Low profile edge clamp socket | Christopher Del Barga, Ronald Michael Kirby | 2019-07-02 |
| 10324112 | Package testing system and method with contact alignment | Mohanraj Prabhugoud, Andrew Hoitink, Abram M. Detofsky | 2019-06-18 |
| 9674943 | Actuation mechanisms for electrical interconnections | Youngseok Oh | 2017-06-06 |