Issued Patents All Time
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12413001 | Heterogenous socket contact for electrical and mechanical performance scaling in a microelectronic package | Zhichao Zhang, Zhe Chen, Steven A. Klein, Feifei Cheng, Kemal Aygun +2 more | 2025-09-09 |
| 12341281 | Micro socket electrical couplings for dies | Debendra Mallik, Joe Walczyk, Saikumar Jayaraman, Feroz Mohammad | 2025-06-24 |
| 12298572 | Device, method and system for optical communication with a photonic integrated circuit chip and a transverse oriented lens structure | Changhua Liu, Pooya Tadayon, Zhichao Zhang, Liang Zhang | 2025-05-13 |
| 12174436 | Package expanded beam connector for on-package optics | Wesley B. Morgan, Todd Coons, Gregorio R. Murtagian, Xiaoqian Li, Nitin A. Deshpande +1 more | 2024-12-24 |
| 12153269 | Active optical coupler | Divya Pratap | 2024-11-26 |
| 12009612 | Dual-sided socket device with corrugation structures and shield structures | Steven A. Klein, Feroz Mohammad, Joe Walczyk, Kuang Liu, Zhichao Zhang | 2024-06-11 |
| 11935860 | Electrical connector with insulated conductive layer | Morten S. Jensen, Michael E. Ryan, Joe Walczyk | 2024-03-19 |
| 11916322 | Dual-sided socket device with corrugation structures | Steven A. Klein, Feroz Mohammad | 2024-02-27 |
| 11862547 | Differential crosstalk self-cancelation in stackable structures | Zhichao Zhang, Zhe Chen, Sriram Srinivasan | 2024-01-02 |
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Harinadh POTLURI +5 more | 2023-11-28 |
| 11808988 | Method and device for fast, passive alignment in photonics assembly | Vineeth John Abraham, Wesley B. Morgan, Eric J. M. Moret, Paul Diglio | 2023-11-07 |
| 11569596 | Pressure features to alter the shape of a socket | Steven A. Klein, Kuang Liu, Feroz Mohammad, Donald T. Tran, Srinivasa R. Aravamudhan +2 more | 2023-01-31 |
| 11217573 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Ravindranath V. Mahajan, Ling Liao, Harinadh POTLURI +5 more | 2022-01-04 |
| 11212932 | Pin count socket having reduced pin count and pattern transformation | Zhichao Zhang, Kemal Aygun | 2021-12-28 |
| 10716231 | Pin count socket having reduced pin count and pattern transformation | Zhichao Zhang, Kemal Aygun | 2020-07-14 |
| 10636716 | Through-mold structures | Sasha N. Oster, Joshua D. Heppner, Adel A. Elsherbini, Yoshihiro Tomita, Debendra Mallik +2 more | 2020-04-28 |
| 10541494 | Connector for processor package | Donald T. Tran, Thomas A. Boyd, Yong Fu Wang, Kevin Ceurter, Russell S. Aoki +1 more | 2020-01-21 |
| 10535615 | Electronic package that includes multi-layer stiffener | Manish Dubey, Rajendra C. Dias, Patrick Nardi | 2020-01-14 |
| 10205292 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2019-02-12 |
| 10044115 | Universal linear edge connector | Donald T. Tran, Gregorio R. Murtagian, Kuang Liu, Feroz Mohammad, Karumbu Meyyappan +3 more | 2018-08-07 |
| 9953909 | Ball grid array (BGA) with anchoring pins | Zuyang Liang, Michael Garcia, Joshua D. Heppner | 2018-04-24 |
| 9780510 | Socket contact techniques and configurations | Dhanya Athreya, Gaurav Chawla, Kemal Aygun, Glen P. Gordon, Sarah M. Canny +3 more | 2017-10-03 |
| 9692147 | Small form factor sockets and connectors | Donald T. Tran, Gregorio R. Murtagian | 2017-06-27 |
| 9502800 | Double-mated edge finger connector | Donald T. Tran, Rajasekaran Swaminathan | 2016-11-22 |
| 9491881 | Microelectronic socket comprising a substrate and an insulative insert mated with openings in the substrate | Joshua D. Heppner, Zhichao Zhang, Michael Garcia | 2016-11-08 |