Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830846 | Heated pins to couple with solder elements | Feroz Mohammad | 2023-11-28 |
| 11569596 | Pressure features to alter the shape of a socket | Steven A. Klein, Kuang Liu, Srikant Nekkanty, Feroz Mohammad, Donald T. Tran +2 more | 2023-01-31 |
| 10573580 | Surface structure method and apparatus associated with compute or electronic component packages | Christopher Combs | 2020-02-25 |
| 10505297 | Pin through solder interconnect and methods | Feroz Mohammad | 2019-12-10 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2018-08-14 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani +6 more | 2017-04-04 |