Mukul Renavikar — 17 Patents at Intel

Mukul Renavikar has been granted 17 US patents while listed as an inventor at Intel. The first was granted in 2006 and the most recent in November 2023. Mukul Renavikar ranks #263,971 of 4,157,543 US inventors in our database (top 6.3%). Patent records list Mukul Renavikar in Chandler, AZ, US.

Issued Patents All Time

Showing 1–17 of 17 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11817364	BGA STIM package architecture for high performance systems	Rajasekaran Swaminathan	2023-11-14	$31,444,000
10049971	Package structure to enhance yield of TMI interconnections	Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more	2018-08-14	$20,895,000
9613933	Package structure to enhance yield of TMI interconnections	Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more	2017-04-04	$8,141,000
9394619	Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby	Rajen S. Sidhu, Sandeep B. Sane	2016-07-19	$7,217,000
8733620	Solder deposition and thermal processing of thin-die thermal interface material	Susheel Jadhav	2014-05-27	$13,313,000
8701281	Substrate metallization and ball attach metallurgy with a novel dopant element	Rajen S. Sidhu, Ashay Dani	2014-04-22	$10,911,000
8436470	Solder joint reliability in microelectronic packaging	Daewoong Suh, Stephen Lehman	2013-05-07	$21,295,000
8409929	Forming a semiconductor package including a thermal interface material	Daewoong Suh, Carl Deppisch, Abhishek Gupta	2013-04-02	$10,070,000
8030757	Forming a semiconductor package including a thermal interface material	Daewoong Suh, Carl Deppisch, Abhishek Gupta	2011-10-04	$13,316,000
8018063	Solder joint reliability in microelectronic packaging	Daewoong Suh, Stephen Lehman	2011-09-13	$15,671,000
7700476	Solder joint reliability in microelectronic packaging	Daewoong Suh, Stephen Lehman	2010-04-20	$20,991,000
7553702	Integrating a heat spreader with an interface material having reduced void size	Thomas J. Fitzgerald, Susheel Jadhav	2009-06-30	$20,585,000
7485495	Integrated heat spreader with intermetallic layer and method for making	Susheel Jadhav	2009-02-03	$17,091,000
7239517	Integrated heat spreader and method for using	Thomas J. Fitzgerald, Susheel Jadhav	2007-07-03	$20,127,000
7205595	Polymer memory device with electron traps	Gudbjorg H. Oskarsdottir	2007-04-17	$18,299,000
7183641	Integrated heat spreader with intermetallic layer and method for making	Susheel Jadhav	2007-02-27	$10,067,000
7087521	Forming an intermediate layer in interconnect joints and structures formed thereby	John Barnak	2006-08-08	$12,359,000

Mukul Renavikar — 17 Patents

Issued Patents All Time

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