Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817364 | BGA STIM package architecture for high performance systems | Rajasekaran Swaminathan | 2023-11-14 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more | 2018-08-14 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Lilia May, Rajen S. Sidhu, Ashay Dani, Edward R. Prack +6 more | 2017-04-04 |
| 9394619 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Rajen S. Sidhu, Sandeep B. Sane | 2016-07-19 |
| 8733620 | Solder deposition and thermal processing of thin-die thermal interface material | Susheel Jadhav | 2014-05-27 |
| 8701281 | Substrate metallization and ball attach metallurgy with a novel dopant element | Rajen S. Sidhu, Ashay Dani | 2014-04-22 |
| 8436470 | Solder joint reliability in microelectronic packaging | Daewoong Suh, Stephen Lehman | 2013-05-07 |
| 8409929 | Forming a semiconductor package including a thermal interface material | Daewoong Suh, Carl Deppisch, Abhishek Gupta | 2013-04-02 |
| 8030757 | Forming a semiconductor package including a thermal interface material | Daewoong Suh, Carl Deppisch, Abhishek Gupta | 2011-10-04 |
| 8018063 | Solder joint reliability in microelectronic packaging | Daewoong Suh, Stephen Lehman | 2011-09-13 |
| 7700476 | Solder joint reliability in microelectronic packaging | Daewoong Suh, Stephen Lehman | 2010-04-20 |
| 7553702 | Integrating a heat spreader with an interface material having reduced void size | Thomas J. Fitzgerald, Susheel Jadhav | 2009-06-30 |
| 7485495 | Integrated heat spreader with intermetallic layer and method for making | Susheel Jadhav | 2009-02-03 |
| 7239517 | Integrated heat spreader and method for using | Thomas J. Fitzgerald, Susheel Jadhav | 2007-07-03 |
| 7205595 | Polymer memory device with electron traps | Gudbjorg H. Oskarsdottir | 2007-04-17 |
| 7183641 | Integrated heat spreader with intermetallic layer and method for making | Susheel Jadhav | 2007-02-27 |
| 7087521 | Forming an intermediate layer in interconnect joints and structures formed thereby | John Barnak | 2006-08-08 |