Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Forming an intermediate layer in interconnect joints and structures formed thereby

Forming an intermediate layer in interconnect joints and structures formed thereby

US Patent 7087521 · Granted Aug 8, 2006

Estimated economic value: $12,359,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

BGA STIM package architecture for high performance systems2023
Package structure to enhance yield of TMI interconnections2018
Package structure to enhance yield of TMI interconnections2017
Methods of adding dopants to conductive interconnect structures in substrate tec2016
Solder deposition and thermal processing of thin-die thermal interface material2014
Substrate metallization and ball attach metallurgy with a novel dopant element2014
Solder joint reliability in microelectronic packaging2013
Forming a semiconductor package including a thermal interface material2013
Forming a semiconductor package including a thermal interface material2011
Solder joint reliability in microelectronic packaging2011
Solder joint reliability in microelectronic packaging2010
Technique to prevent tin contamination of mirrors and electrodes in an EUV litho2009