Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062551 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2024-08-13 |
| 11631595 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2023-04-18 |
| 11272619 | Apparatus with embedded fine line space in a cavity, and a method for forming the same | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Ji-Yong Park, Maroun D. Moussallem +2 more | 2022-03-08 |
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2021-12-07 |
| 11107780 | Pseudo-stripline using double solder-resist structure | Robert Alan May, Amruthavalli Pallavi Alur, Robert L. Sankman | 2021-08-31 |
| 11075130 | Package substrate having polymer-derived ceramic core | Lisa Ying Ying Chen, Lauren A. Link, Robert Alan May, Amruthavalli Pallavi Alur, Kristof Darmawikarta +3 more | 2021-07-27 |
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amanda E. Schuckman | 2020-06-16 |
| 10573622 | Methods of forming joint structures for surface mount packages | Edward R. Prack | 2020-02-25 |
| 10049971 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani, Edward R. Prack +6 more | 2018-08-14 |
| 9613933 | Package structure to enhance yield of TMI interconnections | Thomas J. De Bonis, Rajen S. Sidhu, Mukul Renavikar, Ashay Dani, Edward R. Prack +6 more | 2017-04-04 |