| 12132002 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2024-10-29 |
$18,861,000 |
| 12062551 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May |
2024-08-13 |
$26,861,000 |
| 11694960 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2023-07-04 |
|
| 11631595 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May |
2023-04-18 |
$32,873,000 |
| 11195727 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May |
2021-12-07 |
$28,128,000 |
| 11133257 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2021-09-28 |
$36,743,000 |
| 10916486 |
Semiconductor device including silane based adhesion promoter and method of making |
Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Wei-Lun Kane Jen |
2021-02-09 |
$44,388,000 |
| 10856424 |
Electronic assembly that includes void free holes |
Sri Ranga Sai Boyapati, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad, Kristof Darmawikarta |
2020-12-01 |
$25,476,000 |
| 10685850 |
High density organic interconnect structures |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May |
2020-06-16 |
$36,850,000 |
| 10553453 |
Systems and methods for semiconductor packages using photoimageable layers |
Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more |
2020-02-04 |
$21,361,000 |
| 10475745 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2019-11-12 |
$21,873,000 |
| 10373900 |
Tin-zinc microbump structures and method of making same |
Sri Chaitra Jyotsna Chavali, Kyu Oh Lee |
2019-08-06 |
$15,127,000 |
| 10297563 |
Copper seed layer and nickel-tin microbump structures |
Rahul Jain, Kyu Oh Lee, Steve Cho |
2019-05-21 |
$20,944,000 |
| 10103103 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2018-10-16 |
$21,459,000 |
| 9953959 |
Metal protected fan-out cavity |
Kristof Darmawikarta, Robert Alan May, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li +2 more |
2018-04-24 |
$19,097,000 |
| 9917044 |
Package with bi-layered dielectric structure |
Zheng Zhou, Mihir K. Roy, Chong Zhang, Kyu Oh Lee |
2018-03-13 |
$24,990,000 |
| 9837341 |
Tin-zinc microbump structures |
Sri Chaitra Jyotsna Chavali, Kyu Oh Lee |
2017-12-05 |
$17,379,000 |
| 9741606 |
Desmear with metalized protective film |
Zheng Zhou, Sri Ranga Sai Boyapati |
2017-08-22 |
$8,061,000 |
| 9640485 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2017-05-02 |
$12,076,000 |
| 9147663 |
Bridge interconnection with layered interconnect structures |
Yueli Liu, Qinglei Zhang, Rui Zhang |
2015-09-29 |
$22,047,000 |
| 8877632 |
Providing a void-free filled interconnect structure in a layer of package substrate |
Mark S. Hlad |
2014-11-04 |
$23,728,000 |
