Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132002 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2024-10-29 |
| 12062551 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2024-08-13 |
| 11694960 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2023-07-04 |
| 11631595 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2023-04-18 |
| 11195727 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2021-12-07 |
| 11133257 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2021-09-28 |
| 10916486 | Semiconductor device including silane based adhesion promoter and method of making | Andrew J. Brown, Chi-Mon Chen, Robert Alan May, Wei-Lun Kane Jen | 2021-02-09 |
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Sashi S. Kandanur, Srinivas V. Pietambaram, Mark S. Hlad, Kristof Darmawikarta | 2020-12-01 |
| 10685850 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2020-06-16 |
| 10553453 | Systems and methods for semiconductor packages using photoimageable layers | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Amruthavalli P. Alur, Islam A. Salama, Yikang Deng +1 more | 2020-02-04 |
| 10475745 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2019-11-12 |
| 10373900 | Tin-zinc microbump structures and method of making same | Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2019-08-06 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Rahul Jain, Kyu Oh Lee, Steve Cho | 2019-05-21 |
| 10103103 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2018-10-16 |
| 9953959 | Metal protected fan-out cavity | Kristof Darmawikarta, Robert Alan May, Yikang Deng, Amruthavalli Pallavi Alur, Sheng Li +2 more | 2018-04-24 |
| 9917044 | Package with bi-layered dielectric structure | Zheng Zhou, Mihir K. Roy, Chong Zhang, Kyu Oh Lee | 2018-03-13 |
| 9837341 | Tin-zinc microbump structures | Sri Chaitra Jyotsna Chavali, Kyu Oh Lee | 2017-12-05 |
| 9741606 | Desmear with metalized protective film | Zheng Zhou, Sri Ranga Sai Boyapati | 2017-08-22 |
| 9640485 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2017-05-02 |
| 9147663 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2015-09-29 |
| 8877632 | Providing a void-free filled interconnect structure in a layer of package substrate | Mark S. Hlad | 2014-11-04 |