| 10856424 |
Electronic assembly that includes void free holes |
Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Kristof Darmawikarta |
2020-12-01 |
$25,476,000 |
| 10734282 |
Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
2020-08-04 |
$32,661,000 |
| 10121701 |
Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
2018-11-06 |
$18,970,000 |
| 9824991 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack |
2017-11-21 |
$11,290,000 |
| 9583390 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack |
2017-02-28 |
$9,011,000 |
| 9406587 |
Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
2016-08-02 |
$8,723,000 |
| 9355952 |
Device packaging with substrates having embedded lines and metal defined pads |
Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee |
2016-05-31 |
$9,993,000 |
| 9299602 |
Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package |
Qinglei Zhang, Tao Wu, Charavana K. Gurumurthy |
2016-03-29 |
$14,056,000 |
| 9257276 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack |
2016-02-09 |
$15,927,000 |
| 9198293 |
Non-cylindrical conducting shapes in multilayer laminated substrate cores |
Harold Ryan Chase, Mathew J. Manusharow, Mihir K. Roy |
2015-11-24 |
$18,043,000 |
| 9093313 |
Device packaging with substrates having embedded lines and metal defined pads |
Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee |
2015-07-28 |
$15,934,000 |
| 8877632 |
Providing a void-free filled interconnect structure in a layer of package substrate |
Amanda E. Schuckman |
2014-11-04 |
$23,728,000 |
| 8835217 |
Device packaging with substrates having embedded lines and metal defined pads |
Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee |
2014-09-16 |
$19,366,000 |
| 8809124 |
Bumpless build-up layer and laminated core hybrid structures and methods of assembling same |
Mathew J. Manusharow, Ravi Kiran Nalla |
2014-08-19 |
$23,268,000 |
| 8508037 |
Bumpless build-up layer and laminated core hybrid structures and methods of assembling same |
Mathew J. Manusharow, Ravi Kiran Nalla |
2013-08-13 |
$12,122,000 |
| 8353101 |
Method of making substrate package with through holes for high speed I/O flex cable |
Charan Gurumurthy, Sanka Ganesan, Chandrashekar Ramaswamy |
2013-01-15 |
$22,820,000 |
| 8183692 |
Barrier layer for fine-pitch mask-based substrate bumping |
Ravi Kiran Nalla, Christine H. Tsau |
2012-05-22 |
$25,074,000 |
| 7919408 |
Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates |
Sheng Li |
2011-04-05 |
$23,551,000 |
| 7888784 |
Substrate package with through holes for high speed I/O flex cable |
Charan Gurumurthy, Sanka Ganesan, Chandrashekhar Ramaswamy |
2011-02-15 |
$18,725,000 |
| 7776734 |
Barrier layer for fine-pitch mask-based substrate bumping |
Ravi Kiran Nalla, Christine H. Tsau |
2010-08-17 |
$11,574,000 |
