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Electronic assembly that includes void free holes |
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Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
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Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
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Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack |
2017-11-21 |
| 9583390 |
Organic thin film passivation of metal interconnections |
Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack |
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Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow |
2016-08-02 |
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Device packaging with substrates having embedded lines and metal defined pads |
Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee |
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Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package |
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Organic thin film passivation of metal interconnections |
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Non-cylindrical conducting shapes in multilayer laminated substrate cores |
Harold Ryan Chase, Mathew J. Manusharow, Mihir K. Roy |
2015-11-24 |
| 9093313 |
Device packaging with substrates having embedded lines and metal defined pads |
Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee |
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Providing a void-free filled interconnect structure in a layer of package substrate |
Amanda E. Schuckman |
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Device packaging with substrates having embedded lines and metal defined pads |
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Bumpless build-up layer and laminated core hybrid structures and methods of assembling same |
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Barrier layer for fine-pitch mask-based substrate bumping |
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Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates |
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Barrier layer for fine-pitch mask-based substrate bumping |
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