Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10856424 | Electronic assembly that includes void free holes | Sri Ranga Sai Boyapati, Amanda E. Schuckman, Sashi S. Kandanur, Srinivas V. Pietambaram, Kristof Darmawikarta | 2020-12-01 |
| 10734282 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow | 2020-08-04 |
| 10121701 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow | 2018-11-06 |
| 9824991 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack | 2017-11-21 |
| 9583390 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack | 2017-02-28 |
| 9406587 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow | 2016-08-02 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Qinglei Zhang, Tao Wu, Charavana K. Gurumurthy | 2016-03-29 |
| 9257276 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack | 2016-02-09 |
| 9198293 | Non-cylindrical conducting shapes in multilayer laminated substrate cores | Harold Ryan Chase, Mathew J. Manusharow, Mihir K. Roy | 2015-11-24 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2015-07-28 |
| 8877632 | Providing a void-free filled interconnect structure in a layer of package substrate | Amanda E. Schuckman | 2014-11-04 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2014-09-16 |
| 8809124 | Bumpless build-up layer and laminated core hybrid structures and methods of assembling same | Mathew J. Manusharow, Ravi Kiran Nalla | 2014-08-19 |
| 8508037 | Bumpless build-up layer and laminated core hybrid structures and methods of assembling same | Mathew J. Manusharow, Ravi Kiran Nalla | 2013-08-13 |
| 8353101 | Method of making substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Chandrashekar Ramaswamy | 2013-01-15 |
| 8183692 | Barrier layer for fine-pitch mask-based substrate bumping | Ravi Kiran Nalla, Christine H. Tsau | 2012-05-22 |
| 7919408 | Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates | Sheng Li | 2011-04-05 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Chandrashekhar Ramaswamy | 2011-02-15 |
| 7776734 | Barrier layer for fine-pitch mask-based substrate bumping | Ravi Kiran Nalla, Christine H. Tsau | 2010-08-17 |