{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates", "item": "https://www.patentleaderboard.com/patent/7919408"}]}
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Home › Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates

US Patent 7919408 · Granted Apr 5, 2011

Estimated economic value: $23,551,000 ⓘ

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