Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate

Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate

US Patent 11581271 · Granted Feb 14, 2023

Estimated economic value: $12,790,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Stripped redistrubution-layer fabrication for package-top embedded multi-die int2025
Protruding SN substrate features for epoxy flow control2025
Lithographically defined vertical interconnect access (VIA) for a bridge die fir2025
Soldered metallic reservoirs for enhanced transient and steady-state thermal per2025
Magnetic core inductors on package substrates2025
Magnetic core inductors on package substrates2025
In-plane inductors in IC packages2025
Package with underfill containment barrier2025
Package with underfill containment barrier2025
Package with underfill containment barrier2025