| 12362250 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2025-07-15 |
|
| 12334447 |
Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) |
Kristof Darmawikarta, Tarek A. Ibrahim, Siddharth K. Alur, Haobo Chen |
2025-06-17 |
|
| 12334453 |
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance |
Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more |
2025-06-17 |
|
| 12327773 |
Package with underfill containment barrier |
Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2025-06-10 |
|
| 12224264 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Ji-Yong Park, Kyu Oh Lee |
2025-02-11 |
|
| 12154715 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2024-11-26 |
$26,820,000 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2024-06-11 |
$21,221,000 |
| 11935805 |
Package with underfill containment barrier |
Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2024-03-19 |
$28,784,000 |
| 11901115 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2024-02-13 |
$18,546,000 |
| 11881463 |
Coreless organic packages with embedded die and magnetic inductor structures |
Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani |
2024-01-23 |
$52,361,000 |
| 11862552 |
Methods of embedding magnetic structures in substrates |
Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Lauren A. Link, Andrew J. Brown +2 more |
2024-01-02 |
$30,016,000 |
| 11842981 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Ji-Yong Park, Kyu Oh Lee |
2023-12-12 |
$45,136,000 |
| 11776864 |
Corner guard for improved electroplated first level interconnect bump height range |
Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Tarek A. Ibrahim +4 more |
2023-10-03 |
$24,984,000 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
$16,803,000 |
| 11737208 |
Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong |
2023-08-22 |
$16,803,000 |
| 11664290 |
Package with underfill containment barrier |
Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2023-05-30 |
$16,378,000 |
| 11651902 |
Patterning of thin film capacitors in organic substrate packages |
Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link |
2023-05-16 |
$11,130,000 |
| 11652071 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton |
2023-05-16 |
$11,130,000 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
$20,076,000 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more |
2023-02-14 |
$12,790,000 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu |
2023-01-17 |
$13,997,000 |
| 11450471 |
Methods to selectively embed magnetic materials in substrate and corresponding structures |
Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more |
2022-09-20 |
$15,654,000 |
| 11443892 |
Substrate assembly with encapsulated magnetic feature |
Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more |
2022-09-13 |
$14,653,000 |
| 11443885 |
Thin film barrier seed metallization in magnetic-plugged through hole inductor |
Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more |
2022-09-13 |
$14,653,000 |
| 11432405 |
Methods for attaching large components in a package substrate for advanced power delivery |
Prithwish Chatterjee, Kyu Oh Lee |
2022-08-30 |
$13,077,000 |
