Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12334447 | Lithographically defined vertical interconnect access (VIA) for a bridge die first level interconnect (FLI) | Kristof Darmawikarta, Tarek A. Ibrahim, Siddharth K. Alur, Haobo Chen | 2025-06-17 |
| 12334453 | Soldered metallic reservoirs for enhanced transient and steady-state thermal performance | Nicholas Neal, Nicholas S. Haehn, Sergio Antonio Chan Arguedas, Edvin Cetegen, Jacob VEHONSKY +4 more | 2025-06-17 |
| 12327773 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2025-06-10 |
| 12224264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2025-02-11 |
| 12154715 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2024-11-26 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 11935805 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2024-03-19 |
| 11901115 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2024-02-13 |
| 11881463 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2024-01-23 |
| 11862552 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Lauren A. Link, Andrew J. Brown +2 more | 2024-01-02 |
| 11842981 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2023-12-12 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Tarek A. Ibrahim +4 more | 2023-10-03 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11664290 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2023-05-30 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton | 2023-05-16 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Prithwish Chatterjee, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11557489 | Cavity structures in integrated circuit package supports | Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Kyu Oh Lee, Cheng Xu | 2023-01-17 |
| 11450471 | Methods to selectively embed magnetic materials in substrate and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2022-09-20 |
| 11443885 | Thin film barrier seed metallization in magnetic-plugged through hole inductor | Kristof Darmawikarta, Srinivas V. Pietambaram, Sandeep Gaan, Sri Ranga Sai Boyapati, Prithwish Chatterjee +2 more | 2022-09-13 |
| 11443892 | Substrate assembly with encapsulated magnetic feature | Kyu Oh Lee, Sai Vadlamani, Cheng Xu, Ji-Yong Park, Junnan Zhao +1 more | 2022-09-13 |
| 11432405 | Methods for attaching large components in a package substrate for advanced power delivery | Prithwish Chatterjee, Kyu Oh Lee | 2022-08-30 |