Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417614 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Junnan Zhao, Ji-Yong Park, Sai Vadlamani +1 more | 2022-08-16 |
| 11410921 | Methods to incorporate thin film capacitor sheets (TFC-S) in the build-up films | Kyu Oh Lee | 2022-08-09 |
| 11355459 | Embedding magnetic material, in a cored or coreless semiconductor package | Kyu Oh Lee, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu +1 more | 2022-06-07 |
| 11335632 | Magnetic inductor structures for package devices | Prithwish Chatterjee, Junnan Zhao, Sai Vadlamani, Ying Wang, Andrew J. Brown +3 more | 2022-05-17 |
| 11251113 | Methods of embedding magnetic structures in substrates | Sai Vadlamani, Prithwish Chatterjee, Robert Alan May, Lauren A. Link, Andrew J. Brown +2 more | 2022-02-15 |
| 11244912 | Semiconductor package having a coaxial first layer interconnect | Sai Vadlamani, Aleksandar Aleksov, Kyu Oh Lee, Kristof Darmawikarta, Robert Alan May +2 more | 2022-02-08 |
| 11205626 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2021-12-21 |
| 11158558 | Package with underfill containment barrier | Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more | 2021-10-26 |
| 11139264 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2021-10-05 |
| 10971492 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2021-04-06 |
| 10923443 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Praneeth Akkinepally, Jeremy Ecton | 2021-02-16 |
| 10705293 | Substrate integrated waveguide | Robert Alan May, Kristof Darmawikarta, Sri Ranga Sai Boyapati, Maroun D. Moussallem, Rahul N. Manepalli +1 more | 2020-07-07 |
| 10700021 | Coreless organic packages with embedded die and magnetic inductor structures | Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani | 2020-06-30 |
| 10672859 | Embedded magnetic inductor | Andrew J. Brown, Sheng Li, Sai Vadlamani, Chong Zhang | 2020-06-02 |
| 10643994 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2020-05-05 |
| 10468374 | Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate | Ji-Yong Park, Kyu Oh Lee | 2019-11-05 |
| 10373951 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Cheng Xu, Seo Young Kim, Kyu Oh Lee, Ji-Yong Park, Sai Vadlamani +1 more | 2019-08-06 |
| 10297563 | Copper seed layer and nickel-tin microbump structures | Kyu Oh Lee, Amanda E. Schuckman, Steve Cho | 2019-05-21 |
| 9820386 | Plasma etching of solder resist openings | Kristof Darmawikarta, Robert Alan May, Sheng Li, Sri Ranga Sai Boyapati | 2017-11-14 |