| 12362250 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2025-07-15 |
|
| 12327773 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more |
2025-06-10 |
|
| 12130482 |
Hydrophobic feature to control adhesive flow |
Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Ziyin Lin, Joseph Van Nausdle |
2024-10-29 |
$18,861,000 |
| 12009271 |
Protruding SN substrate features for epoxy flow control |
Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more |
2024-06-11 |
$21,221,000 |
| 12002727 |
Barrier structures for underfill containment |
Ziyin Lin, Wei Li, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more |
2024-06-04 |
$24,500,000 |
| 11935805 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more |
2024-03-19 |
$28,784,000 |
| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2023-10-03 |
$24,984,000 |
| 11749585 |
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package |
Yiqun Bai, John C. DECKER, Ziyin Lin |
2023-09-05 |
$19,899,000 |
| 11688634 |
Trenches in wafer level packages for improvements in warpage reliability and thermals |
Yiqun Bai, Ziyin Lin, John C. DECKER, Yan Li |
2023-06-27 |
$18,721,000 |
| 11676876 |
Semiconductor die package with warpage management and process for forming such |
Ziyin Lin, Elizabeth Nofen, Taylor Gaines |
2023-06-13 |
$22,204,000 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more |
2023-05-30 |
$16,378,000 |
| 11545441 |
Semiconductor package having wafer-level active die and external die mount |
Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman |
2023-01-03 |
$15,575,000 |
| 11282717 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2022-03-22 |
$16,833,000 |
| 11158558 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more |
2021-10-26 |
$21,268,000 |
| 10910317 |
Semiconductor package having wafer-level active die and external die mount |
Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman |
2021-02-02 |
$28,243,000 |
| 10403578 |
Electronic device package |
Digvijay A. Raorane |
2019-09-03 |
$18,715,000 |
| 10373888 |
Electronic package assembly with compact die placement |
Eric J. Li, Digvijay A. Raorane |
2019-08-06 |
$15,127,000 |
| 10290592 |
Semiconductor package, and a method for forming a semiconductor package |
John J. Beatty, Suzana Prstic |
2019-05-14 |
$24,469,000 |
| 8895365 |
Techniques and configurations for surface treatment of an integrated circuit substrate |
Suriyakala Ramalingam, Rajen S. Sidhu, Nisha Ananthakrishnan, Sivakumar Nagarajan, Wei Tan +1 more |
2014-11-25 |
$33,083,000 |
