Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362250 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2025-07-15 |
| 12327773 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2025-06-10 |
| 12130482 | Hydrophobic feature to control adhesive flow | Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Ziyin Lin, Joseph Van Nausdle | 2024-10-29 |
| 12009271 | Protruding SN substrate features for epoxy flow control | Edvin Cetegen, Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho +5 more | 2024-06-11 |
| 12002727 | Barrier structures for underfill containment | Ziyin Lin, Wei Li, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more | 2024-06-04 |
| 11935805 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2024-03-19 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, John C. DECKER, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Yiqun Bai, Ziyin Lin, John C. DECKER, Yan Li | 2023-06-27 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Ziyin Lin, Elizabeth Nofen, Taylor Gaines | 2023-06-13 |
| 11664290 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2023-05-30 |
| 11545441 | Semiconductor package having wafer-level active die and external die mount | Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2023-01-03 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2022-03-22 |
| 11158558 | Package with underfill containment barrier | Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Ashish Dhall +4 more | 2021-10-26 |
| 10910317 | Semiconductor package having wafer-level active die and external die mount | Eric J. Li, Sanka Ganesan, Debendra Mallik, Robert L. Sankman | 2021-02-02 |
| 10403578 | Electronic device package | Digvijay A. Raorane | 2019-09-03 |
| 10373888 | Electronic package assembly with compact die placement | Eric J. Li, Digvijay A. Raorane | 2019-08-06 |
| 10290592 | Semiconductor package, and a method for forming a semiconductor package | John J. Beatty, Suzana Prstic | 2019-05-14 |
| 8895365 | Techniques and configurations for surface treatment of an integrated circuit substrate | Suriyakala Ramalingam, Rajen S. Sidhu, Nisha Ananthakrishnan, Sivakumar Nagarajan, Wei Tan +1 more | 2014-11-25 |