Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130482 | Hydrophobic feature to control adhesive flow | Bassam M. Ziadeh, Jingyi Huang, Ziyin Lin, Vipul V. Mehta, Joseph Van Nausdle | 2024-10-29 |
| 12099245 | Completely encapsulated optical multi chip package | Asako Toda, Chia-Pin Chiu, Xiaoqian Li | 2024-09-24 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Vipul V. Mehta, John C. DECKER, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Ziyin Lin, John C. DECKER, Yan Li | 2023-06-27 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | Elizabeth Nofen, James C. Matayabas, Jr., Yawei Liang | 2023-01-24 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |
| 10115606 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2018-10-30 |
| 9704767 | Mold compound with reinforced fibers | Suriyakala Ramalingam, Nisha Ananthakrishnan, Arjun Krishnan | 2017-07-11 |
| 9611372 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Arjun Krishnan | 2017-04-04 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu, Beverly J. Canham +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Nisha Ananthakrishnan, Arjun Krishnan | 2016-02-23 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Purushotham Kaushik Muthur Srinath | 2016-01-05 |
| 8999765 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Purushotham Kaushik Muthur Srinath | 2015-04-07 |
| 8916981 | Epoxy-amine underfill materials for semiconductor packages | Yonghao Xiu, Nisha Ananthakrishnan, Nachiket R. Raravikar | 2014-12-23 |
| 8012808 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Qing Zhou, Jianqqi He | 2011-09-06 |
| 7432592 | Integrated micro-channels for 3D through silicon architectures | Wei Shi, Daoqiang Lu, Qing Zhou, Jiangqi He | 2008-10-07 |