Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2024-12-31 |
| 12130482 | Hydrophobic feature to control adhesive flow | Jingyi Huang, Yiqun Bai, Ziyin Lin, Vipul V. Mehta, Joseph Van Nausdle | 2024-10-29 |
| 11764080 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2023-09-19 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2022-05-10 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2020-08-11 |
| 10681851 | Pick and place tooling with adjustable nozzle configuration | Alin Ila, Nathan P. Heckathorne | 2020-06-09 |
| 10580758 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2020-03-03 |
| 10529600 | Decoupling systems | Nathan P. Heckathorne, Douglas Heymann | 2020-01-07 |
| 10483177 | Package for a semiconductor die, method for making a die packaging bare die tape and method for semiconductor die packaging | John Lofgren, Santosh Pabba, Kevin Pounds, Alin Ila | 2019-11-19 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2019-09-03 |
| 10214340 | Containers for holding and dispensing stacks of electronic device components | Mingjie Xu, Pan Gu, Michael Garcia, Zhizhong Tang | 2019-02-26 |
| 10037976 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2018-07-31 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Yoshihiro Tomita | 2018-06-05 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Yoshihiro Tomita | 2018-02-20 |
| 9793244 | Scalable package architecture and associated techniques and configurations | Sanka Ganesan, Nitesh Nimkar | 2017-10-17 |
| 9741692 | Methods to form high density through-mold interconnections | Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Eric J. Li, Debendra Mallik | 2017-08-22 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Yoshihiro Tomita | 2017-02-21 |