Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12130482 | Hydrophobic feature to control adhesive flow | Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Vipul V. Mehta, Joseph Van Nausdle | 2024-10-29 |
| 12068222 | Dummy die structures of a packaged integrated circuit device | Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more | 2024-08-20 |
| 12002727 | Barrier structures for underfill containment | Vipul V. Mehta, Wei Li, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more | 2024-06-04 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, Vipul V. Mehta, John C. DECKER | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Yiqun Bai, John C. DECKER, Yan Li | 2023-06-27 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Elizabeth Nofen, Vipul V. Mehta, Taylor Gaines | 2023-06-13 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more | 2022-03-22 |