Ziyin Lin — 8 Patents at Intel

Ziyin Lin has been granted 8 US patents while listed as an inventor at Intel. The first was granted in 2022 and the most recent in October 2024. Ziyin Lin ranks #600,572 of 4,157,543 US inventors in our database (top 14.4%). Patent records list Ziyin Lin in Chandler, AZ, US.

Patents per Year

Issued Patents All Time

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12130482	Hydrophobic feature to control adhesive flow	Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Vipul V. Mehta, Joseph Van Nausdle	2024-10-29	$18,861,000
12068222	Dummy die structures of a packaged integrated circuit device	Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more	2024-08-20	$20,163,000
12002727	Barrier structures for underfill containment	Vipul V. Mehta, Wei Li, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more	2024-06-04	$24,500,000
11776821	Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap	Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more	2023-10-03	$24,984,000
11749585	High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package	Yiqun Bai, Vipul V. Mehta, John C. DECKER	2023-09-05	$19,899,000
11688634	Trenches in wafer level packages for improvements in warpage reliability and thermals	Vipul V. Mehta, Yiqun Bai, John C. DECKER, Yan Li	2023-06-27	$18,721,000
11676876	Semiconductor die package with warpage management and process for forming such	Elizabeth Nofen, Vipul V. Mehta, Taylor Gaines	2023-06-13	$22,204,000
11282717	Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap	Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more	2022-03-22	$16,833,000