| 12130482 |
Hydrophobic feature to control adhesive flow |
Bassam M. Ziadeh, Jingyi Huang, Yiqun Bai, Vipul V. Mehta, Joseph Van Nausdle |
2024-10-29 |
| 12068222 |
Dummy die structures of a packaged integrated circuit device |
Mitul Modi, Joseph Van Nausdle, Omkar G. Karhade, Edvin Cetegen, Nicholas S. Haehn +4 more |
2024-08-20 |
| 12002727 |
Barrier structures for underfill containment |
Vipul V. Mehta, Wei Li, Edvin Cetegen, Xavier Francois Brun, Yang Guo +6 more |
2024-06-04 |
| 11776821 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2023-10-03 |
| 11749585 |
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package |
Yiqun Bai, Vipul V. Mehta, John C. DECKER |
2023-09-05 |
| 11688634 |
Trenches in wafer level packages for improvements in warpage reliability and thermals |
Vipul V. Mehta, Yiqun Bai, John C. DECKER, Yan Li |
2023-06-27 |
| 11676876 |
Semiconductor die package with warpage management and process for forming such |
Elizabeth Nofen, Vipul V. Mehta, Taylor Gaines |
2023-06-13 |
| 11282717 |
Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap |
Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Sushrutha Gujjula, Nisha Ananthakrishnan +1 more |
2022-03-22 |