Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12366713 | Heat dissipation structures for optical communication devices | Omkar G. Karhade, Tolga Acikalin, Kelly Lofgreen, Ravindranath V. Mahajan, Chia-Pin Chiu | 2025-07-22 |
| 11830863 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao +5 more | 2023-11-28 |
| 11776821 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Nisha Ananthakrishnan +1 more | 2023-10-03 |
| 11282717 | Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap | Ziyin Lin, Vipul V. Mehta, Edvin Cetegen, Yuying Wei, Nisha Ananthakrishnan +1 more | 2022-03-22 |
| 11217573 | Dual-sided co-packaged optics for high bandwidth networking applications | Suresh Pothukuchi, Andrew C. Alduino, Ravindranath V. Mahajan, Srikant Nekkanty, Ling Liao +5 more | 2022-01-04 |