| 12417958 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-09-16 |
| 12347743 |
Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-07-01 |
| 12315777 |
Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone |
Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more |
2025-05-27 |
| 11749585 |
High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package |
Yiqun Bai, Vipul V. Mehta, Ziyin Lin |
2023-09-05 |
| 11688634 |
Trenches in wafer level packages for improvements in warpage reliability and thermals |
Vipul V. Mehta, Yiqun Bai, Ziyin Lin, Yan Li |
2023-06-27 |