Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-09-16 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-05-27 |
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, Vipul V. Mehta, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Yiqun Bai, Ziyin Lin, Yan Li | 2023-06-27 |