John C. DECKER — 5 Patents at Intel

John C. DECKER has been granted 5 US patents while listed as an inventor at Intel. The first was granted in 2023 and the most recent in September 2025. John C. DECKER ranks #907,971 of 4,157,543 US inventors in our database (top 21.8%). Patent records list John C. DECKER in Tempe, AZ, US.

Issued Patents All Time

Showing 1–5 of 5 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12417958	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-09-16
12347743	Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-07-01
12315777	Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone	Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more	2025-05-27
11749585	High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package	Yiqun Bai, Vipul V. Mehta, Ziyin Lin	2023-09-05	$19,899,000
11688634	Trenches in wafer level packages for improvements in warpage reliability and thermals	Vipul V. Mehta, Yiqun Bai, Ziyin Lin, Yan Li	2023-06-27	$18,721,000

John C. DECKER — 5 Patents

Issued Patents All Time

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