Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-09-16 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan, Robert M. Nickerson +4 more | 2025-05-27 |
| 12258439 | Mechanophore-grafted polymers to form stress-responsive thermoset network | Lenore Dai, Aditi Chattopadhyay, Jin Zou, Bonsung Koo | 2025-03-25 |
| 11753498 | Mechanophore-grafted polymers to form stress-responsive thermoset network | Lenore Dai, Aditi Chattopadhyay, Jin Zou, Bonsung Koo | 2023-09-12 |
| 11676876 | Semiconductor die package with warpage management and process for forming such | Ziyin Lin, Vipul V. Mehta, Taylor Gaines | 2023-06-13 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | James C. Matayabas, Jr., Yawei Liang, Yiqun Bai | 2023-01-24 |
| 11034791 | Mechanophore-grafted polymers to form stress-responsive thermoset network | Lenore Dai, Aditi Chattopadhyay, Jin Zou, Bonsung Koo | 2021-06-15 |
| 8790670 | Detergent compositions dispersed in personal care products comprising a sorbent carrier | Travis T. Yarlagadda, Sarah Moore, Tasha Zander, Saiid Mohammed, Gerald Decker +3 more | 2014-07-29 |