Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417958 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and PoP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-09-16 |
| 12406906 | Through mold interconnect drill feature | Robert M. Nickerson, Rees WINTERS | 2025-09-02 |
| 12394773 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Robert M. Nickerson, Shripad Gokhale | 2025-08-19 |
| 12362340 | Laser ablation-based surface property modification and contamination removal | Denis Myasishchev, Andrew V. Mazur, Robert M. Nickerson, Shripad Gokhale | 2025-07-15 |
| 12347743 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-07-01 |
| 12315777 | Microelectronics package comprising a package-on-package (POP) architecture with inkjet barrier material for controlling bondline thickness and POP adhesive keep out zone | Elizabeth Nofen, Shripad Gokhale, Nick Ross, Amram Eitan, Nisha Ananthakrishnan +4 more | 2025-05-27 |
| 11705383 | Through mold interconnect drill feature | Robert M. Nickerson, Rees WINTERS | 2023-07-18 |
| 11551956 | Method and device for failure analysis using RF-based thermometry | Chandrashekara Shashank Kaira, Phillip C. Miller, Deepak Goyal | 2023-01-10 |
| 11476120 | Method of sample preparation using dual ion beam trenching | Richard Kenneth Brewer, Deepak Goyal | 2022-10-18 |
| 10607909 | Systems, methods, and apparatuses for implementing a thermal solution for 3D packaging | Pramod Malatkar, Sairam Agraharam, Chandra Mohan Jha, Arnab Choudhury, Nachiket R. Raravikar | 2020-03-31 |
| 10361167 | Electronic assembly using bismuth-rich solder | Pilin Liu, Deepak Goyal | 2019-07-23 |
| 9625256 | Device, system and method for alignment of an integrated circuit assembly | Mario Pacheco, Deepak Goyal | 2017-04-18 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai | 2016-01-05 |
| 8999765 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Yonghao Xiu, Arjun Krishnan, Yiqun Bai | 2015-04-07 |