Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more | 2022-07-12 |
| 10361167 | Electronic assembly using bismuth-rich solder | Purushotham Kaushik Muthur Srinath, Deepak Goyal | 2019-07-23 |
| 8759974 | Solder joints with enhanced electromigration resistance | Mengzhi Pang, Charavanakumara Gurumurthy | 2014-06-24 |
| 8013444 | Solder joints with enhanced electromigration resistance | Mengzhi Pang, Charavanakumara Gurumurthy | 2011-09-06 |