Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10741515 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy | 2020-08-11 |
| 10373924 | Grid array connection device and method | Munehiro Toyama, Siew Fong Tai, Kian Sin Sim, Tamil Selvy Selvamuniandy | 2019-08-06 |
| 8759974 | Solder joints with enhanced electromigration resistance | Mengzhi Pang, Pilin Liu | 2014-06-24 |
| 8461036 | Multiple surface finishes for microelectronic package substrates | Tao Wu, Reynaldo A. Olmedo | 2013-06-11 |
| 8013444 | Solder joints with enhanced electromigration resistance | Mengzhi Pang, Pilin Liu | 2011-09-06 |