Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11576256 | Printed circuit board for gallium nitride elements | Jian Qi | 2023-02-07 |
| 11516915 | Reduced capacitance land pad | Zhichao Zhang, Gaurav Chawla, Jeffrey Lee | 2022-11-29 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2022-09-13 |
| 11217866 | Battery module for improving safety | Chin-Din Hou | 2022-01-04 |
| 11206513 | Vehicle density over the air update scheduling | Jerry John, Yun Ho Lee | 2021-12-21 |
| 10923943 | Battery powered device with pre-powered circuit | Chia-Chang Chen | 2021-02-16 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2020-04-21 |
| 10440668 | Vehicle platooning management and power control with LTE/5G V2X communications | — | 2019-10-08 |
| 10433421 | Reduced capacitance land pad | Zhichao Zhang, Gaurav Chawla, Jeffrey Lee | 2019-10-01 |
| 9806011 | Non-uniform substrate stackup | Zhichao Zhang, Zhiguo Qian, Kemal Aygun | 2017-10-31 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Mihir K. Roy, Wei-Lun Kane Jen, Yi Li | 2017-07-11 |
| 9607937 | Pin grid interposer | Nicholas R. Watts | 2017-03-28 |
| 9564407 | Crosstalk polarity reversal and cancellation through substrate material | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2017-02-07 |
| 9488483 | Localization using road markings | Ananth Ranganathan | 2016-11-08 |
| 9461679 | System, method, and apparatus for analog signal conditioning of high-speed data streams | Davide Guermandi, Silvian Spiridon, Dongsoo Daniel Koh, Stefano Bozzola, Han Yan +1 more | 2016-10-04 |
| 9391018 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2016-07-12 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9331017 | Chip package incorporating interfacial adhesion through conductor sputtering | Islam A. Salama | 2016-05-03 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Qinglei Zhang, Mark S. Hlad, Charavana K. Gurumurthy | 2016-03-29 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Zhiguo Qian, Kemal Aygun | 2016-01-05 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Yueli Liu, Kyu Oh Lee | 2015-07-28 |
| 9053372 | Road marking detection and recognition | Ananth Ranganathan | 2015-06-09 |
| 8871634 | Chip package incorporating interfacial adhesion through conductor sputtering | Islam A. Salama | 2014-10-28 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Yueli Liu, Kyu Oh Lee | 2014-09-16 |
| 8643184 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2014-02-04 |