Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400363 | Device and method for improved fiducial marker detection | Hong Seung YEON, Nicholas S. Haehn, Wei Li, Raquel DE SOUZA BORGES FERREIRA, Minglu LIU +4 more | 2025-08-26 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more | 2022-09-27 |
| 11443970 | Methods of forming a package substrate | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2022-09-13 |
| 10957667 | Indium solder metallurgy to control electro-migration | Kyu Oh Lee, Yueli Liu | 2021-03-23 |
| 10629469 | Solder resist layers for coreless packages and methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2020-04-21 |
| 9704735 | Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabrication | Manohar S. Konchady, Tao Wu, Mihir K. Roy, Wei-Lun Kane Jen | 2017-07-11 |
| 8138239 | Polymer thermal interface materials | Ed Prack, Wei Wu | 2012-03-20 |
| 7929259 | Magnetic sensing device including a sense enhancing layer | Zheng Gao, Brian William Karr, Song S. Xue, Eric L. Granstrom, Khuong T. Tran | 2011-04-19 |
| 7800868 | Magnetic sensing device including a sense enhancing layer | Zheng Gao, Brian William Karr, Song S. Xue, Eric L. Granstrom, Khuong T. Tran | 2010-09-21 |