Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132002 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2024-10-29 |
| 11694960 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2023-07-04 |
| 11133257 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2021-09-28 |
| 10957667 | Indium solder metallurgy to control electro-migration | Kyu Oh Lee, Yi Li | 2021-03-23 |
| 10475745 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2019-11-12 |
| 10103103 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2018-10-16 |
| 9640485 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2017-05-02 |
| 9502336 | Coreless substrate with passive device pads | Qinglei Zhang | 2016-11-22 |
| 9412625 | Molded insulator in package assembly | — | 2016-08-09 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Kyu Oh Lee | 2016-05-31 |
| 9147638 | Interconnect structures for embedded bridge | Chong Zhang, Qinglei Zhang | 2015-09-29 |
| 9147663 | Bridge interconnection with layered interconnect structures | Qinglei Zhang, Amanda E. Schuckman, Rui Zhang | 2015-09-29 |
| 9113573 | Molded insulator in package assembly | — | 2015-08-18 |
| 9093313 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Kyu Oh Lee | 2015-07-28 |
| 8835217 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Kyu Oh Lee | 2014-09-16 |