Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12107082 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Robert M. Nickerson | 2024-10-01 |
| 11978730 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Robert M. Nickerson | 2024-05-07 |
| 11798932 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Robert M. Nickerson | 2023-10-24 |
| 10607976 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Robert M. Nickerson | 2020-03-31 |
| 10446530 | Offset interposers for large-bottom packages and large-die package-on-package structures | Russell K. Mortensen, Robert M. Nickerson | 2019-10-15 |
| 9960079 | Passive within via | Todd Myers, Eric Palmer, Jui Min Lim | 2018-05-01 |
| 9780054 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla | 2017-10-03 |
| 9607937 | Pin grid interposer | Tao Wu | 2017-03-28 |
| 8901724 | Semiconductor package with embedded die and its methods of fabrication | John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla | 2014-12-02 |
| 8860205 | Method of stiffening coreless package substrate | Sriram Muthukumar, John S. Guzek | 2014-10-14 |
| 7952202 | Method of embedding passive component within via | Todd Myers, Eric Palmer, Jui Min Lim | 2011-05-31 |
| 7952182 | Semiconductor device with package to package connection | Javier Soto Gonzalez | 2011-05-31 |
| 7851269 | Method of stiffening coreless package substrate | Sriram Muthukumar, John S. Guzek | 2010-12-14 |
| 7737025 | Via including multiple electrical paths | Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim | 2010-06-15 |
| 7275316 | Method of embedding passive component within via | Todd Myers, Eric Palmer, Jui Min Lim | 2007-10-02 |
| 7183653 | Via including multiple electrical paths | Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim | 2007-02-27 |
| 6606237 | Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same | Yasuyuki Naito, Masaaki Taniguchi, Yoichi Kuroda, Haruo Hori, David G. Figueroa +3 more | 2003-08-12 |
| 6556453 | Electronic circuit housing with trench vias and method of fabrication therefor | David G. Figueroa | 2003-04-29 |