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Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Robert M. Nickerson |
2024-10-01 |
| 11978730 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Robert M. Nickerson |
2024-05-07 |
| 11798932 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Robert M. Nickerson |
2023-10-24 |
| 10607976 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Robert M. Nickerson |
2020-03-31 |
| 10446530 |
Offset interposers for large-bottom packages and large-die package-on-package structures |
Russell K. Mortensen, Robert M. Nickerson |
2019-10-15 |
| 9960079 |
Passive within via |
Todd Myers, Eric Palmer, Jui Min Lim |
2018-05-01 |
| 9780054 |
Semiconductor package with embedded die and its methods of fabrication |
John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla |
2017-10-03 |
| 9607937 |
Pin grid interposer |
Tao Wu |
2017-03-28 |
| 8901724 |
Semiconductor package with embedded die and its methods of fabrication |
John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla |
2014-12-02 |
| 8860205 |
Method of stiffening coreless package substrate |
Sriram Muthukumar, John S. Guzek |
2014-10-14 |
| 7952202 |
Method of embedding passive component within via |
Todd Myers, Eric Palmer, Jui Min Lim |
2011-05-31 |
| 7952182 |
Semiconductor device with package to package connection |
Javier Soto Gonzalez |
2011-05-31 |
| 7851269 |
Method of stiffening coreless package substrate |
Sriram Muthukumar, John S. Guzek |
2010-12-14 |
| 7737025 |
Via including multiple electrical paths |
Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim |
2010-06-15 |
| 7275316 |
Method of embedding passive component within via |
Todd Myers, Eric Palmer, Jui Min Lim |
2007-10-02 |
| 7183653 |
Via including multiple electrical paths |
Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim |
2007-02-27 |
| 6606237 |
Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same |
Yasuyuki Naito, Masaaki Taniguchi, Yoichi Kuroda, Haruo Hori, David G. Figueroa +3 more |
2003-08-12 |
| 6556453 |
Electronic circuit housing with trench vias and method of fabrication therefor |
David G. Figueroa |
2003-04-29 |