Nicholas R. Watts — 18 Patents at Intel

Nicholas R. Watts has been granted 18 US patents while listed as an inventor at Intel. The first was granted in 2003 and the most recent in October 2024. Nicholas R. Watts ranks #245,716 of 4,157,543 US inventors in our database (top 5.9%). Patent records list Nicholas R. Watts in Phoenix, AZ, US.

Patents per Year

Issued Patents All Time

Showing 1–18 of 18 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12107082	Offset interposers for large-bottom packages and large-die package-on-package structures	Russell K. Mortensen, Robert M. Nickerson	2024-10-01	$20,560,000
11978730	Offset interposers for large-bottom packages and large-die package-on-package structures	Russell K. Mortensen, Robert M. Nickerson	2024-05-07	$26,756,000
11798932	Offset interposers for large-bottom packages and large-die package-on-package structures	Russell K. Mortensen, Robert M. Nickerson	2023-10-24	$20,059,000
10607976	Offset interposers for large-bottom packages and large-die package-on-package structures	Russell K. Mortensen, Robert M. Nickerson	2020-03-31	$34,068,000
10446530	Offset interposers for large-bottom packages and large-die package-on-package structures	Russell K. Mortensen, Robert M. Nickerson	2019-10-15	$18,012,000
9960079	Passive within via	Todd Myers, Eric Palmer, Jui Min Lim	2018-05-01	$34,156,000
9780054	Semiconductor package with embedded die and its methods of fabrication	John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla	2017-10-03	$11,313,000
9607937	Pin grid interposer	Tao Wu	2017-03-28	$8,391,000
8901724	Semiconductor package with embedded die and its methods of fabrication	John S. Guzek, Javier Soto Gonzalez, Ravi Kiran Nalla	2014-12-02	$19,830,000
8860205	Method of stiffening coreless package substrate	Sriram Muthukumar, John S. Guzek	2014-10-14	$15,559,000
7952202	Method of embedding passive component within via	Todd Myers, Eric Palmer, Jui Min Lim	2011-05-31	$17,665,000
7952182	Semiconductor device with package to package connection	Javier Soto Gonzalez	2011-05-31	$17,665,000
7851269	Method of stiffening coreless package substrate	Sriram Muthukumar, John S. Guzek	2010-12-14	$13,117,000
7737025	Via including multiple electrical paths	Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim	2010-06-15	$15,580,000
7275316	Method of embedding passive component within via	Todd Myers, Eric Palmer, Jui Min Lim	2007-10-02	$20,761,000
7183653	Via including multiple electrical paths	Todd Myers, Eric Palmer, Renee M Defeo, Jui Min Lim	2007-02-27	$10,067,000
6606237	Multilayer capacitor, wiring board, decoupling circuit, and high frequency circuit incorporating the same	Yasuyuki Naito, Masaaki Taniguchi, Yoichi Kuroda, Haruo Hori, David G. Figueroa +3 more	2003-08-12	$56,289,000
6556453	Electronic circuit housing with trench vias and method of fabrication therefor	David G. Figueroa	2003-04-29	$39,757,000

Nicholas R. Watts — 18 Patents

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