Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9960079 | Passive within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2018-05-01 |
| 8487446 | Method of embedding passive component within via | Todd Myers, Nicolas R. Watts, Eric Palmer | 2013-07-16 |
| 8018072 | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate | Jeffrey Alan Miks | 2011-09-13 |
| 7952202 | Method of embedding passive component within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2011-05-31 |
| 7737025 | Via including multiple electrical paths | Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo | 2010-06-15 |
| 7275316 | Method of embedding passive component within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2007-10-02 |
| 7183653 | Via including multiple electrical paths | Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo | 2007-02-27 |