Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9960079 | Passive within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2018-05-01 | $34,156,000 |
| 8487446 | Method of embedding passive component within via | Todd Myers, Nicolas R. Watts, Eric Palmer | 2013-07-16 | $27,254,000 |
| 8018072 | Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate | Jeffrey Alan Miks | 2011-09-13 | $2,426,000 |
| 7952202 | Method of embedding passive component within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2011-05-31 | $17,665,000 |
| 7737025 | Via including multiple electrical paths | Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo | 2010-06-15 | $15,580,000 |
| 7275316 | Method of embedding passive component within via | Todd Myers, Nicholas R. Watts, Eric Palmer | 2007-10-02 | $20,761,000 |
| 7183653 | Via including multiple electrical paths | Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo | 2007-02-27 | $10,067,000 |