| 9960079 |
Passive within via |
Todd Myers, Nicholas R. Watts, Eric Palmer |
2018-05-01 |
| 8487446 |
Method of embedding passive component within via |
Todd Myers, Nicolas R. Watts, Eric Palmer |
2013-07-16 |
| 8018072 |
Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate |
Jeffrey Alan Miks |
2011-09-13 |
| 7952202 |
Method of embedding passive component within via |
Todd Myers, Nicholas R. Watts, Eric Palmer |
2011-05-31 |
| 7737025 |
Via including multiple electrical paths |
Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo |
2010-06-15 |
| 7275316 |
Method of embedding passive component within via |
Todd Myers, Nicholas R. Watts, Eric Palmer |
2007-10-02 |
| 7183653 |
Via including multiple electrical paths |
Todd Myers, Nicholas R. Watts, Eric Palmer, Renee M Defeo |
2007-02-27 |