Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8487446 | Method of embedding passive component within via | Todd Myers, Eric Palmer, Jui Min Lim | 2013-07-16 | $27,254,000 |
| 8127979 | Electrolytic depositon and via filling in coreless substrate processing | Tao Wu | 2012-03-06 | $22,588,000 |