Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8487446 | Method of embedding passive component within via | Todd Myers, Eric Palmer, Jui Min Lim | 2013-07-16 |
| 8127979 | Electrolytic depositon and via filling in coreless substrate processing | Tao Wu | 2012-03-06 |