Eric Palmer — 9 Patents at Intel

Eric Palmer has been granted 9 US patents while listed as an inventor at Intel. The first was granted in 2007 and the most recent in May 2018. Eric Palmer ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Eric Palmer in Tempe, AZ, US.

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9960079	Passive within via	Todd Myers, Nicholas R. Watts, Jui Min Lim	2018-05-01	$34,156,000
8487446	Method of embedding passive component within via	Todd Myers, Nicolas R. Watts, Jui Min Lim	2013-07-16	$27,254,000
8188594	Input/output package architectures	Sanka Ganesan, Kemal Aygun, Chandrashekhar Ramaswamy, Henning Braunisch	2012-05-29	$17,150,000
8093704	Package on package using a bump-less build up layer (BBUL) package	John S. Guzek	2012-01-10	$25,673,000
7952202	Method of embedding passive component within via	Todd Myers, Nicholas R. Watts, Jui Min Lim	2011-05-31	$17,665,000
7737025	Via including multiple electrical paths	Todd Myers, Nicholas R. Watts, Renee M Defeo, Jui Min Lim	2010-06-15	$15,580,000
7705447	Input/output package architectures, and methods of using same	Sanka Ganesan, Kemal Aygun, Chandrashekhar Ramaswamy, Henning Braunisch	2010-04-27	$12,857,000
7275316	Method of embedding passive component within via	Todd Myers, Nicholas R. Watts, Jui Min Lim	2007-10-02	$20,761,000
7183653	Via including multiple electrical paths	Todd Myers, Nicholas R. Watts, Renee M Defeo, Jui Min Lim	2007-02-27	$10,067,000

Eric Palmer — 9 Patents

Issued Patents All Time

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