Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8188594 | Input/output package architectures | Sanka Ganesan, Kemal Aygun, Eric Palmer, Henning Braunisch | 2012-05-29 |
| 7888784 | Substrate package with through holes for high speed I/O flex cable | Charan Gurumurthy, Sanka Ganesan, Mark S. Hlad | 2011-02-15 |
| 7705447 | Input/output package architectures, and methods of using same | Sanka Ganesan, Kemal Aygun, Eric Palmer, Henning Braunisch | 2010-04-27 |
| 7530814 | Providing variable sized contacts for coupling with a semiconductor device | Thomas G. Ruttan, Mark D. Summers | 2009-05-12 |
| 7193318 | Multiple power density chip structure | Evan G. Colgan, George A. Katopis, Herbert I. Stoller | 2007-03-20 |