Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate

Semiconductor package having a heat spreader with an exposed exterion surface and a top mold gate

US Patent 8018072 · Granted Sep 13, 2011

Estimated economic value: $2,426,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Passive within via2018
High density memory card using folded flex2016
Top port with interposer MEMS microphone package and method2013
Method of embedding passive component within via2013
Micro-optical device packaging system2013
Thermal via heat spreader package and method2011
Method of embedding passive component within via2011
Via including multiple electrical paths2010
Tape supported memory card leadframe structure2009
Secure digital memory card using land grid array structure2009
Drop resistant bumpers for fully molded memory cards2009
Interposer for interconnecting components in a memory card2008