| 12422396 |
Systems and methods for multi-modal and multiplexed electrochemical detection and reporting of environmental contaminants |
Vikram Narayanan Dhamu |
2025-09-23 |
|
| 12310725 |
High density analog multipexing |
Devangsingh Gajendarsingh Sankhala |
2025-05-27 |
|
| 12076143 |
Wearable biosensors with room temperature ionic liquid buffer |
Shalini Prasad |
2024-09-03 |
|
| 11782055 |
Multi-configurable sensing array and methods of using same |
Shalini Prasad |
2023-10-10 |
|
| 11217516 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
Charles A. Gealer |
2022-01-04 |
$22,100,000 |
| 10379592 |
Power management of an NZE IoT device |
Dileep J. Kurian, Tanay Karnik, David Arditti Ilitzky, Ankit Gupta, Vaibhav Vaidya +3 more |
2019-08-13 |
$24,877,000 |
| 10186480 |
Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same |
Charles A. Gealer |
2019-01-22 |
$27,645,000 |
| 10134689 |
Warpage compensation metal for wafer level packaging technology |
Vivek Swaminathan Sridharan, Amit S. Kelkar |
2018-11-20 |
$45,841,000 |
| 10006882 |
Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces |
Shalini Prasad, Anjan Panneer Selvam |
2018-06-26 |
|
| 9806047 |
Wafer level device and method with cantilever pillar structure |
Karthik Thambidurai, Peter R. Harper, Arkadii V. Samoilov |
2017-10-31 |
$30,235,000 |
| 9728515 |
Integrated WLUF and SOD process |
Rubayat Mahmud, Saikumar Jayaraman |
2017-08-08 |
$11,912,000 |
| 9349698 |
Integrated WLUF and SOD process |
Rubayat Mahmud, Saikumar Jayaraman |
2016-05-24 |
$13,693,000 |
| 8860205 |
Method of stiffening coreless package substrate |
Nicholas R. Watts, John S. Guzek |
2014-10-14 |
$15,559,000 |
| 8502400 |
Methods and apparatuses to stiffen integrated circuit package |
Prasanna Karpur |
2013-08-06 |
$18,826,000 |
| 8387240 |
Methods for making multi-chip packaging using an interposer |
Raul Mancera, Yoshihiro Tomita, Chi Won Hwang |
2013-03-05 |
$12,770,000 |
| 8143110 |
Methods and apparatuses to stiffen integrated circuit package |
Prasanna Karpur |
2012-03-27 |
$20,416,000 |
| 8030782 |
Metal-metal bonding of compliant interconnect |
Shriram Ramanathan |
2011-10-04 |
$13,316,000 |
| 7882628 |
Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias |
Raul Mancera, Yoshihiro Tomita, Chi Won Hwang |
2011-02-08 |
$12,723,000 |
| 7851269 |
Method of stiffening coreless package substrate |
Nicholas R. Watts, John S. Guzek |
2010-12-14 |
$13,117,000 |
| 7841080 |
Multi-chip packaging using an interposer with through-vias |
Raul Mancera, Yoshihiro Tomita, Chi Won Hwang |
2010-11-30 |
$13,201,000 |
| 7800402 |
Look-up table overdrive circuits |
Irfan Rahim, William Bradley Vest, Myron W. Wong |
2010-09-21 |
$6,185,000 |
| 7750487 |
Metal-metal bonding of compliant interconnect |
Shriram Ramanathan |
2010-07-06 |
$9,424,000 |
| 7589424 |
Thin silicon based substrate |
Devendra Natekar |
2009-09-15 |
$19,566,000 |
| 7443030 |
Thin silicon based substrate |
Devendra Natekar |
2008-10-28 |
$18,166,000 |
| 7400030 |
Schottky diode with silver layer contacting the ZnO and MgxZn1−xO films |
Yicheng Lu, Haifeng Sheng, Nuri Emanetoglu, Jian Zhong, Shaohua Liang |
2008-07-15 |
|
