Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422396 | Systems and methods for multi-modal and multiplexed electrochemical detection and reporting of environmental contaminants | Vikram Narayanan Dhamu | 2025-09-23 |
| 12310725 | High density analog multipexing | Devangsingh Gajendarsingh Sankhala | 2025-05-27 |
| 12076143 | Wearable biosensors with room temperature ionic liquid buffer | Shalini Prasad | 2024-09-03 |
| 11782055 | Multi-configurable sensing array and methods of using same | Shalini Prasad | 2023-10-10 |
| 11217516 | Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same | Charles A. Gealer | 2022-01-04 |
| 10379592 | Power management of an NZE IoT device | Dileep J. Kurian, Tanay Karnik, David Arditti Ilitzky, Ankit Gupta, Vaibhav Vaidya +3 more | 2019-08-13 |
| 10186480 | Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same | Charles A. Gealer | 2019-01-22 |
| 10134689 | Warpage compensation metal for wafer level packaging technology | Vivek Swaminathan Sridharan, Amit S. Kelkar | 2018-11-20 |
| 10006882 | Biosensing system and methods using electron-ionic mechanisms at fluid-sensor interfaces | Shalini Prasad, Anjan Panneer Selvam | 2018-06-26 |
| 9806047 | Wafer level device and method with cantilever pillar structure | Karthik Thambidurai, Peter R. Harper, Arkadii V. Samoilov | 2017-10-31 |
| 9728515 | Integrated WLUF and SOD process | Rubayat Mahmud, Saikumar Jayaraman | 2017-08-08 |
| 9349698 | Integrated WLUF and SOD process | Rubayat Mahmud, Saikumar Jayaraman | 2016-05-24 |
| 8860205 | Method of stiffening coreless package substrate | Nicholas R. Watts, John S. Guzek | 2014-10-14 |
| 8502400 | Methods and apparatuses to stiffen integrated circuit package | Prasanna Karpur | 2013-08-06 |
| 8387240 | Methods for making multi-chip packaging using an interposer | Raul Mancera, Yoshihiro Tomita, Chi Won Hwang | 2013-03-05 |
| 8143110 | Methods and apparatuses to stiffen integrated circuit package | Prasanna Karpur | 2012-03-27 |
| 8030782 | Metal-metal bonding of compliant interconnect | Shriram Ramanathan | 2011-10-04 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Raul Mancera, Yoshihiro Tomita, Chi Won Hwang | 2011-02-08 |
| 7851269 | Method of stiffening coreless package substrate | Nicholas R. Watts, John S. Guzek | 2010-12-14 |
| 7841080 | Multi-chip packaging using an interposer with through-vias | Raul Mancera, Yoshihiro Tomita, Chi Won Hwang | 2010-11-30 |
| 7800402 | Look-up table overdrive circuits | Irfan Rahim, William Bradley Vest, Myron W. Wong | 2010-09-21 |
| 7750487 | Metal-metal bonding of compliant interconnect | Shriram Ramanathan | 2010-07-06 |
| 7589424 | Thin silicon based substrate | Devendra Natekar | 2009-09-15 |
| 7443030 | Thin silicon based substrate | Devendra Natekar | 2008-10-28 |
| 7400030 | Schottky diode with silver layer contacting the ZnO and MgxZn1−xO films | Yicheng Lu, Haifeng Sheng, Nuri Emanetoglu, Jian Zhong, Shaohua Liang | 2008-07-15 |