Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12309923 | Printed circuit board and method for manufacturing the same | Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Suk Chang Hong | 2025-05-20 |
| 12309924 | Connection structure embedded substrate and substrate structure including the same | Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee | 2025-05-20 |
| 12262470 | Printed circuit board | Jin Uk Lee, Eun Sun Kim, Yong Wan Ji | 2025-03-25 |
| 12211816 | Printed circuit board and electronic component package including the same | Young Kuk Ko, Sang Hoon Kim, Suk Chang Hong, Gyu Mook Kim | 2025-01-28 |
| 12213251 | Printed circuit board | Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Suk Chang Hong | 2025-01-28 |
| 12004296 | Printed circuit board | Jin Uk Lee, Eun Sun Kim, Yong Wan Ji, Young Hun You | 2024-06-04 |
| 11997788 | Printed circuit board and method of manufacturing the same | Sang Hoon Kim, Young Kuk Ko, Gyu Mook Kim, Hea Sung Kim, Suk Chang Hong | 2024-05-28 |
| 11737211 | Connection structure embedded substrate and substrate structure including the same | Tae Hong Min, Ho Hyung Ham, Yong Soon Jang, Ki-Suk Kim, Hyung Ki Lee | 2023-08-22 |
| 11178761 | Printed circuit board and method of manufacturing the same | Jung-Hyun Cho, Kyung Hwan Ko | 2021-11-16 |
| 10925161 | Printed circuit board | Kyung Hwan Ko, Jin Hyun Kim, Byung Kuk Kang, Jung-Hyun Cho | 2021-02-16 |
| 9832884 | Conductive ball mounting device | — | 2017-11-28 |
| 9096941 | Electrolytic cell for flow through-continuous deionization | Teak Sung Hwang, Sung Gyu Park, Hui-Man Park, Noh-Seok Kwak, Chang Sik HA | 2015-08-04 |
| 8975207 | Method for manufacturing adsorptive ball for recovering precious metals and flow through-continuous deionization (FT-CDI) apparatus using the same | Teak Sung Hwang, Won Ho Jung, Noh-Seok Kwak, Sung Gyu Park, Jin Sun Koo +2 more | 2015-03-10 |
| 8391016 | Carbon nanotube-reinforced solder caps, and chip packages and systems containing same | — | 2013-03-05 |
| 8387240 | Methods for making multi-chip packaging using an interposer | Sriram Muthukumar, Raul Mancera, Yoshihiro Tomita | 2013-03-05 |
| 7952203 | Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby | — | 2011-05-31 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Raul Mancera, Yoshihiro Tomita | 2011-02-08 |
| 7841080 | Multi-chip packaging using an interposer with through-vias | Sriram Muthukumar, Raul Mancera, Yoshihiro Tomita | 2010-11-30 |
| 7600667 | Method of assembling carbon nanotube reinforced solder caps | — | 2009-10-13 |
| 7535099 | Sintered metallic thermal interface materials for microelectronic cooling assemblies | Daewoong Suh | 2009-05-19 |
| 7514116 | Horizontal Carbon Nanotubes by Vertical Growth and Rolling | Devendra Natekar, Yoshihiro Tomita | 2009-04-07 |
| 7268077 | Carbon nanotube reinforced metallic layer | — | 2007-09-11 |