Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8387240 | Methods for making multi-chip packaging using an interposer | Sriram Muthukumar, Yoshihiro Tomita, Chi Won Hwang | 2013-03-05 |
| 7882628 | Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias | Sriram Muthukumar, Yoshihiro Tomita, Chi Won Hwang | 2011-02-08 |
| 7841080 | Multi-chip packaging using an interposer with through-vias | Sriram Muthukumar, Yoshihiro Tomita, Chi Won Hwang | 2010-11-30 |
| 7576434 | Wafer-level solder bumps | James K. Lake | 2009-08-18 |