| 9622356 |
Electronic package mounting |
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2017-04-11 |
| 7576434 |
Wafer-level solder bumps |
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| 6145735 |
Thin film solder paste deposition method and tools |
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2000-11-14 |
| 6019270 |
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| 5414303 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
Stephen Gonya, Randy C. Long, Roger N. Wild |
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| 5411703 |
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Stephen Gonya, Randy C. Long, Roger N. Wild |
1995-05-02 |
| 5393489 |
High temperature, lead-free, tin based solder composition |
Stephen Gonya, Randy C. Long, Roger N. Wild |
1995-02-28 |
| 5368814 |
Lead free, tin-bismuth solder alloys |
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1994-11-29 |
| 5344607 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
Stephen Gonya, Randy C. Long, Roger N. Wild |
1994-09-06 |
| 5328660 |
Lead-free, high temperature, tin based multi-component solder |
Stephen Gonya, Randy C. Long, Roger N. Wild |
1994-07-12 |
