| 10827608 |
Conformal 3D non-planar multi-layer circuitry |
Kenn Twigg, Jim Patterson |
2020-11-03 |
$322,457,000 |
| 10568204 |
Conformal 3D non-planar multi-layer circuitry |
Kenn Twigg, Jim Patterson |
2020-02-18 |
$57,341,000 |
| 10154584 |
Method of producing a fine line 3D non-planar conforming circuit |
James S. Eiche, James Patterson, Kenneth R. Twigg |
2018-12-11 |
$73,335,000 |
| 10123410 |
Fine line 3D non-planar conforming circuit |
James S. Eiche, James Patterson, Kenneth R. Twigg |
2018-11-06 |
$61,845,000 |
| 9894760 |
Conformal 3D non-planar multi-layer circuitry |
Kenn Twigg, Jim Patterson |
2018-02-13 |
$59,015,000 |
| 9812228 |
X-ray obscuration film and related techniques |
Jesse Iannon |
2017-11-07 |
$70,121,000 |
| 9515030 |
X-ray obscuration film and related techniques |
Jesse Iannon |
2016-12-06 |
$23,479,000 |
| 9263400 |
X-ray obscuration film and related techniques |
Jesse Iannon |
2016-02-16 |
$18,039,000 |
| 9258907 |
Conformal 3D non-planar multi-layer circuitry |
Kenn Twigg, Jim Patterson |
2016-02-09 |
$49,347,000 |
| 9087617 |
X-ray obscuration film and related techniques |
Jesse Iannon |
2015-07-21 |
$32,269,000 |
| 8878072 |
High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment |
Jim Patterson, Kenn Twigg |
2014-11-04 |
$28,387,000 |
| 8772745 |
X-ray obscuration film and related techniques |
Jesse Iannon |
2014-07-08 |
$29,145,000 |
| 7804179 |
Plastic ball grid array ruggedization |
Charles H. Dando, III, William E. Murphy |
2010-09-28 |
$20,653,000 |
| 7242365 |
Seam arrangement for a radome |
Robert K. Boatman |
2007-07-10 |
$40,567,000 |
| 7151504 |
Multi-layer radome |
Robert K. Boatman |
2006-12-19 |
$37,349,000 |
| 6410857 |
Signal cross-over interconnect for a double-sided circuit card assembly |
— |
2002-06-25 |
$26,745,000 |
| 5414303 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
James K. Lake, Randy C. Long, Roger N. Wild |
1995-05-09 |
$8,374,000 |
| 5411703 |
Lead-free, tin, antimony, bismtuh, copper solder alloy |
James K. Lake, Randy C. Long, Roger N. Wild |
1995-05-02 |
$11,222,000 |
| 5393489 |
High temperature, lead-free, tin based solder composition |
James K. Lake, Randy C. Long, Roger N. Wild |
1995-02-28 |
$10,414,000 |
| 5368814 |
Lead free, tin-bismuth solder alloys |
James K. Lake, Randy C. Long, Roger N. Wild |
1994-11-29 |
$21,326,000 |
| 5344607 |
Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium |
James K. Lake, Randy C. Long, Roger N. Wild |
1994-09-06 |
$13,761,000 |
| 5328660 |
Lead-free, high temperature, tin based multi-component solder |
James K. Lake, Randy C. Long, Roger N. Wild |
1994-07-12 |
$13,187,000 |
