SG

Stephen Gonya

LM Lockheed Martin: 16 patents #80 of 6,507Top 2%
IBM: 6 patents #16,453 of 70,183Top 25%
Overall (All Time): #195,078 of 4,157,543Top 5%
22
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
10827608 Conformal 3D non-planar multi-layer circuitry Kenn Twigg, Jim Patterson 2020-11-03
10568204 Conformal 3D non-planar multi-layer circuitry Kenn Twigg, Jim Patterson 2020-02-18
10154584 Method of producing a fine line 3D non-planar conforming circuit James S. Eiche, James Patterson, Kenneth R. Twigg 2018-12-11
10123410 Fine line 3D non-planar conforming circuit James S. Eiche, James Patterson, Kenneth R. Twigg 2018-11-06
9894760 Conformal 3D non-planar multi-layer circuitry Kenn Twigg, Jim Patterson 2018-02-13
9812228 X-ray obscuration film and related techniques Jesse Iannon 2017-11-07
9515030 X-ray obscuration film and related techniques Jesse Iannon 2016-12-06
9263400 X-ray obscuration film and related techniques Jesse Iannon 2016-02-16
9258907 Conformal 3D non-planar multi-layer circuitry Kenn Twigg, Jim Patterson 2016-02-09
9087617 X-ray obscuration film and related techniques Jesse Iannon 2015-07-21
8878072 High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment Jim Patterson, Kenn Twigg 2014-11-04
8772745 X-ray obscuration film and related techniques Jesse Iannon 2014-07-08
7804179 Plastic ball grid array ruggedization Charles H. Dando, III, William E. Murphy 2010-09-28
7242365 Seam arrangement for a radome Robert K. Boatman 2007-07-10
7151504 Multi-layer radome Robert K. Boatman 2006-12-19
6410857 Signal cross-over interconnect for a double-sided circuit card assembly 2002-06-25
5414303 Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium James K. Lake, Randy C. Long, Roger N. Wild 1995-05-09
5411703 Lead-free, tin, antimony, bismtuh, copper solder alloy James K. Lake, Randy C. Long, Roger N. Wild 1995-05-02
5393489 High temperature, lead-free, tin based solder composition James K. Lake, Randy C. Long, Roger N. Wild 1995-02-28
5368814 Lead free, tin-bismuth solder alloys James K. Lake, Randy C. Long, Roger N. Wild 1994-11-29
5344607 Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium James K. Lake, Randy C. Long, Roger N. Wild 1994-09-06
5328660 Lead-free, high temperature, tin based multi-component solder James K. Lake, Randy C. Long, Roger N. Wild 1994-07-12