Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10827608 | Conformal 3D non-planar multi-layer circuitry | Kenn Twigg, Jim Patterson | 2020-11-03 |
| 10568204 | Conformal 3D non-planar multi-layer circuitry | Kenn Twigg, Jim Patterson | 2020-02-18 |
| 10154584 | Method of producing a fine line 3D non-planar conforming circuit | James S. Eiche, James Patterson, Kenneth R. Twigg | 2018-12-11 |
| 10123410 | Fine line 3D non-planar conforming circuit | James S. Eiche, James Patterson, Kenneth R. Twigg | 2018-11-06 |
| 9894760 | Conformal 3D non-planar multi-layer circuitry | Kenn Twigg, Jim Patterson | 2018-02-13 |
| 9812228 | X-ray obscuration film and related techniques | Jesse Iannon | 2017-11-07 |
| 9515030 | X-ray obscuration film and related techniques | Jesse Iannon | 2016-12-06 |
| 9263400 | X-ray obscuration film and related techniques | Jesse Iannon | 2016-02-16 |
| 9258907 | Conformal 3D non-planar multi-layer circuitry | Kenn Twigg, Jim Patterson | 2016-02-09 |
| 9087617 | X-ray obscuration film and related techniques | Jesse Iannon | 2015-07-21 |
| 8878072 | High reliability fluid-tight low-profile electrically conductive interconnects for large scale frame attachment | Jim Patterson, Kenn Twigg | 2014-11-04 |
| 8772745 | X-ray obscuration film and related techniques | Jesse Iannon | 2014-07-08 |
| 7804179 | Plastic ball grid array ruggedization | Charles H. Dando, III, William E. Murphy | 2010-09-28 |
| 7242365 | Seam arrangement for a radome | Robert K. Boatman | 2007-07-10 |
| 7151504 | Multi-layer radome | Robert K. Boatman | 2006-12-19 |
| 6410857 | Signal cross-over interconnect for a double-sided circuit card assembly | — | 2002-06-25 |
| 5414303 | Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium | James K. Lake, Randy C. Long, Roger N. Wild | 1995-05-09 |
| 5411703 | Lead-free, tin, antimony, bismtuh, copper solder alloy | James K. Lake, Randy C. Long, Roger N. Wild | 1995-05-02 |
| 5393489 | High temperature, lead-free, tin based solder composition | James K. Lake, Randy C. Long, Roger N. Wild | 1995-02-28 |
| 5368814 | Lead free, tin-bismuth solder alloys | James K. Lake, Randy C. Long, Roger N. Wild | 1994-11-29 |
| 5344607 | Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium | James K. Lake, Randy C. Long, Roger N. Wild | 1994-09-06 |
| 5328660 | Lead-free, high temperature, tin based multi-component solder | James K. Lake, Randy C. Long, Roger N. Wild | 1994-07-12 |