Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead free, tin-bismuth solder alloys

Lead free, tin-bismuth solder alloys

US Patent 5368814 · Granted Nov 29, 1994

Estimated economic value: $21,326,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conformal 3D non-planar multi-layer circuitry2020
Conformal 3D non-planar multi-layer circuitry2020
Method of producing a fine line 3D non-planar conforming circuit2018
Fine line 3D non-planar conforming circuit2018
Conformal 3D non-planar multi-layer circuitry2018
X-ray obscuration film and related techniques2017
Electronic package mounting2017
X-ray obscuration film and related techniques2016
X-ray obscuration film and related techniques2016
Conformal 3D non-planar multi-layer circuitry2016
X-ray obscuration film and related techniques2015
High reliability fluid-tight low-profile electrically conductive interconnects f2014