Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8518750 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Gregory M. Chrysler | 2013-08-27 |
| 8409924 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Gregory M. Chrysler | 2013-04-02 |
| 8227907 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Gregory M. Chrysler | 2012-07-24 |
| 7915081 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Gregory M. Chrysler | 2011-03-29 |
| 7592704 | Etched interposer for integrated circuit devices | Terry Sterrett | 2009-09-22 |
| 7589424 | Thin silicon based substrate | Sriram Muthukumar | 2009-09-15 |
| 7528006 | Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion | Leonel Arana, Michael Newman | 2009-05-05 |
| 7514116 | Horizontal Carbon Nanotubes by Vertical Growth and Rolling | Yoshihiro Tomita, Chi Won Hwang | 2009-04-07 |
| 7443030 | Thin silicon based substrate | Sriram Muthukumar | 2008-10-28 |
| 7413995 | Etched interposer for integrated circuit devices | Terry Sterrett | 2008-08-19 |
| 7402515 | Method of forming through-silicon vias with stress buffer collars and resulting devices | Leonel Arana, Michael Newman, Charan Gurumurthy | 2008-07-22 |
| 7144299 | Methods and devices for supporting substrates using fluids | Leonel Arana, Terry Sterrett | 2006-12-05 |
| 7049208 | Method of manufacturing of thin based substrate | Sriram Muthukumar | 2006-05-23 |
| 6803653 | Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability | Robert E. Likins, Richard C. Blish, II, Sharad M. Shah, Sidharth Sidharth | 2004-10-12 |