| 8518750 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Gregory M. Chrysler |
2013-08-27 |
| 8409924 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Gregory M. Chrysler |
2013-04-02 |
| 8227907 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Gregory M. Chrysler |
2012-07-24 |
| 7915081 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Gregory M. Chrysler |
2011-03-29 |
| 7592704 |
Etched interposer for integrated circuit devices |
Terry Sterrett |
2009-09-22 |
| 7589424 |
Thin silicon based substrate |
Sriram Muthukumar |
2009-09-15 |
| 7528006 |
Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion |
Leonel Arana, Michael Newman |
2009-05-05 |
| 7514116 |
Horizontal Carbon Nanotubes by Vertical Growth and Rolling |
Yoshihiro Tomita, Chi Won Hwang |
2009-04-07 |
| 7443030 |
Thin silicon based substrate |
Sriram Muthukumar |
2008-10-28 |
| 7413995 |
Etched interposer for integrated circuit devices |
Terry Sterrett |
2008-08-19 |
| 7402515 |
Method of forming through-silicon vias with stress buffer collars and resulting devices |
Leonel Arana, Michael Newman, Charan Gurumurthy |
2008-07-22 |
| 7144299 |
Methods and devices for supporting substrates using fluids |
Leonel Arana, Terry Sterrett |
2006-12-05 |
| 7049208 |
Method of manufacturing of thin based substrate |
Sriram Muthukumar |
2006-05-23 |
| 6803653 |
Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability |
Robert E. Likins, Richard C. Blish, II, Sharad M. Shah, Sidharth Sidharth |
2004-10-12 |