Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7955892 | Multiple size package socket | — | 2011-06-07 |
| 6812485 | Dual interposer packaging for high density interconnect | David Bach, Angelo Villani, Nicholas Palmer | 2004-11-02 |
| 6803653 | Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability | Robert E. Likins, Richard C. Blish, II, Sidharth Sidharth, Devendra Natekar | 2004-10-12 |