Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10744320 | Magnetic field detector for implantable medical devices | — | 2020-08-18 |
| 10475733 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2019-11-12 |
| 10403510 | Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate | Andrew Cao | 2019-09-03 |
| 10396114 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey | 2019-08-27 |
| 10297582 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi +3 more | 2019-05-21 |
| 10181411 | Method for fabricating a carrier-less silicon interposer | Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2019-01-15 |
| 10103094 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2018-10-16 |
| 9893030 | Reliable device assembly | Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Terrence Caskey | 2018-02-13 |
| 9691693 | Carrier-less silicon interposer using photo patterned polymer as substrate | Andrew Cao | 2017-06-27 |
| 9685401 | Structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2017-06-20 |
| 9558964 | Method of fabricating low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey | 2017-01-31 |
| 9502390 | BVA interposer | Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi +3 more | 2016-11-22 |
| 9398700 | Method of forming a reliable microelectronic assembly | Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Terrence Caskey | 2016-07-19 |
| 9379008 | Metal PVD-free conducting structures | Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2016-06-28 |
| 9355905 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Charles G. Woychik, Terrence Caskey | 2016-05-31 |
| 9312175 | Surface modified TSV structure and methods thereof | Belgacem Haba, Fatima Lina Ayatollahi, Pezhman Monadgemi | 2016-04-12 |
| 9237648 | Carrier-less silicon interposer | Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey | 2016-01-12 |
| 9123780 | Method and structures for heat dissipating interposers | Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more | 2015-09-01 |
| 9064933 | Methods and structure for carrier-less thin wafer handling | Cyprian Emeka Uzoh, Pezhman Monadgemi, Charles G. Woychik, Terrence Caskey | 2015-06-23 |
| 8981564 | Metal PVD-free conducting structures | Charles G. Woychik, Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey | 2015-03-17 |
| 8884427 | Low CTE interposer without TSV structure | Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey | 2014-11-11 |
| 7592697 | Microelectronic package and method of cooling same | Leonel Arana, Je-Young Chang | 2009-09-22 |
| 7528006 | Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion | Leonel Arana, Devendra Natekar | 2009-05-05 |
| 7402515 | Method of forming through-silicon vias with stress buffer collars and resulting devices | Leonel Arana, Devendra Natekar, Charan Gurumurthy | 2008-07-22 |