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Magnetic field detector for implantable medical devices |
— |
2020-08-18 |
$60,161,000 |
| 10475733 |
Method and structures for heat dissipating interposers |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more |
2019-11-12 |
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| 10403510 |
Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate |
Andrew Cao |
2019-09-03 |
|
| 10396114 |
Method of fabricating low CTE interposer without TSV structure |
Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey |
2019-08-27 |
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| 10297582 |
BVA interposer |
Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi +3 more |
2019-05-21 |
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| 10181411 |
Method for fabricating a carrier-less silicon interposer |
Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey |
2019-01-15 |
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| 10103094 |
Method and structures for heat dissipating interposers |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more |
2018-10-16 |
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| 9893030 |
Reliable device assembly |
Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Terrence Caskey |
2018-02-13 |
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| 9691693 |
Carrier-less silicon interposer using photo patterned polymer as substrate |
Andrew Cao |
2017-06-27 |
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| 9685401 |
Structures for heat dissipating interposers |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more |
2017-06-20 |
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| 9558964 |
Method of fabricating low CTE interposer without TSV structure |
Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey |
2017-01-31 |
|
| 9502390 |
BVA interposer |
Terrence Caskey, Ilyas Mohammed, Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi +3 more |
2016-11-22 |
|
| 9398700 |
Method of forming a reliable microelectronic assembly |
Cyprian Emeka Uzoh, Belgacem Haba, Charles G. Woychik, Terrence Caskey |
2016-07-19 |
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| 9379008 |
Metal PVD-free conducting structures |
Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey |
2016-06-28 |
|
| 9355905 |
Methods and structure for carrier-less thin wafer handling |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Charles G. Woychik, Terrence Caskey |
2016-05-31 |
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| 9312175 |
Surface modified TSV structure and methods thereof |
Belgacem Haba, Fatima Lina Ayatollahi, Pezhman Monadgemi |
2016-04-12 |
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| 9237648 |
Carrier-less silicon interposer |
Cyprian Emeka Uzoh, Charles G. Woychik, Pezhman Monadgemi, Terrence Caskey |
2016-01-12 |
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| 9123780 |
Method and structures for heat dissipating interposers |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey, Fatima Lina Ayatollahi, Belgacem Haba +1 more |
2015-09-01 |
|
| 9064933 |
Methods and structure for carrier-less thin wafer handling |
Cyprian Emeka Uzoh, Pezhman Monadgemi, Charles G. Woychik, Terrence Caskey |
2015-06-23 |
|
| 8981564 |
Metal PVD-free conducting structures |
Charles G. Woychik, Cyprian Emeka Uzoh, Pezhman Monadgemi, Terrence Caskey |
2015-03-17 |
|
| 8884427 |
Low CTE interposer without TSV structure |
Charles G. Woychik, Cyprian Emeka Uzoh, Terrence Caskey |
2014-11-11 |
|
| 7592697 |
Microelectronic package and method of cooling same |
Leonel Arana, Je-Young Chang |
2009-09-22 |
$29,735,000 |
| 7528006 |
Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion |
Leonel Arana, Devendra Natekar |
2009-05-05 |
$25,050,000 |
| 7402515 |
Method of forming through-silicon vias with stress buffer collars and resulting devices |
Leonel Arana, Devendra Natekar, Charan Gurumurthy |
2008-07-22 |
$18,979,000 |
