Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of fabricating low CTE interposer without TSV structure

Method of fabricating low CTE interposer without TSV structure

US Patent 9558964 · Granted Jan 31, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Metal pads over TSV2025
Structures with through-substrate vias and methods for forming the same2025
Die processing2025
Direct bonding methods and structures2025
Techniques for processing devices2025
Through-dielectric-vias (TDVs) for 3D integrated circuits in silicon2025
Seal for microelectronic assembly2025
Direct hybrid bonding of substrates having microelectronic components with diffe2025
Processing stacked substrates2025
Dimension compensation control for directly bonded structures2025