Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Dimension compensation control for directly bonded structures

Dimension compensation control for directly bonded structures

US Patent 12341125 · Granted Jun 24, 2025

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Expansion controlled structure for direct bonding and method of forming same2025
Integrated cooling assembly with upper and lower channels2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Cooling channel shape with substantially constant cross sectional area2025
Metal pads over TSV2025
Metal pads over TSV2025
Metal pads over TSV2025
Structures with through-substrate vias and methods for forming the same2025
Structures with through-substrate vias and methods for forming the same2025
DBI to Si bonding for simplified handle wafer2025
Heterogeneous annealing method and device2025