Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method and structures for heat dissipating interposers

Method and structures for heat dissipating interposers

US Patent 10475733 · Granted Nov 12, 2019

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Expansion controlled structure for direct bonding and method of forming same2025
Integrated cooling assembly with upper and lower channels2025
Directly bonded metal structures having aluminum features and methods of prepari2025
Embedded organic interposer for high bandwidth2025
Package-on-package assembly with wire bonds to encapsulation surface2025
Metal pads over TSV2025
Metal pads over TSV2025
3D NAND-high aspect ratio strings and channels2025
Structures with through-substrate vias and methods for forming the same2025
Bonded structure including an obstructive element directly bonded to a semicondu2025
Protective elements for bonded structures2025
Circuitry for electrical redundancy in bonded structures2025