Issued Patents All Time
Showing 25 most recent of 102 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406582 | Apparatus to minimize thermal impedance using copper on die backside | Fay Hua, James G. Maveety, Kramadhati V. Ravi | 2016-08-02 |
| 8686277 | Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same | Mohammad M. Farahani, Kris Frutschy | 2014-04-01 |
| 8623705 | Nanotube based vapor chamber for die level cooling | Unnikrishnan Vadakkanmaruveedu, James G. Maveety | 2014-01-07 |
| 8518750 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Devendra Natekar | 2013-08-27 |
| 8505613 | Die having a via filled with a heat-dissipating material | James G. Maveety | 2013-08-13 |
| 8409924 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Devendra Natekar | 2013-04-02 |
| 8404519 | Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns | Thomas Dory, James G. Maveety, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2013-03-26 |
| 8333569 | Method and apparatus for two-phase start-up operation | Ioan Sauciuc | 2012-12-18 |
| 8313282 | Compact air-plus-liquid thermal management module | Yousef Jarrah, Patrick D. Harper, Shen Zhao, Glen Meadows, Christopher Best +2 more | 2012-11-20 |
| 8227907 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Devendra Natekar | 2012-07-24 |
| 8209989 | Microarchitecture control for thermoelectric cooling | Pedro Chaparro Monferrer, Jose Gonzalez | 2012-07-03 |
| 8164169 | Cooling devices in semiconductor packages | Tony A. Opheim | 2012-04-24 |
| 8125075 | Carbon nanotube micro-chimney and thermo siphon die-level cooling | James G. Maveety, Unnikrishnan Vadakkanmaruveedu | 2012-02-28 |
| 8006747 | Micro-chimney and thermosiphon die-level cooling | James G. Maveety | 2011-08-30 |
| 7964447 | Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal | Thomas Dory, James G. Maveety, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu | 2011-06-21 |
| 7915081 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, David Chau, Devendra Natekar | 2011-03-29 |
| 7911052 | Nanotube based vapor chamber for die level cooling | Unnikrishnan Vadakkanmaruveedu, James G. Maveety | 2011-03-22 |
| 7851905 | Microelectronic package and method of cooling an interconnect feature in same | Ravi Mahajan, Chia-Pin Chiu | 2010-12-14 |
| 7825503 | Covered devices in a semiconductor package | Tony A. Opheim | 2010-11-02 |
| 7795711 | Microelectronic cooling apparatus and associated method | Ioan Sauciuc | 2010-09-14 |
| 7779638 | Localized microelectronic cooling apparatuses and associated methods and systems | Ioan Sauciuc | 2010-08-24 |
| 7713839 | Diamond substrate formation for electronic assemblies | Chuan Hu, Daoqiang Lu | 2010-05-11 |
| 7633753 | Piezoelectric air jet augmented cooling for electronic devices | Ioan Sauciuc, Hakan Erturk | 2009-12-15 |
| 7622327 | Covered devices in a semiconductor package | Tony A. Opheim | 2009-11-24 |
| 7589417 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Steven Towle | 2009-09-15 |