| 9406582 |
Apparatus to minimize thermal impedance using copper on die backside |
Fay Hua, James G. Maveety, Kramadhati V. Ravi |
2016-08-02 |
$8,723,000 |
| 8686277 |
Microelectronic assembly including built-in thermoelectric cooler and method of fabricating same |
Mohammad M. Farahani, Kris Frutschy |
2014-04-01 |
$15,469,000 |
| 8623705 |
Nanotube based vapor chamber for die level cooling |
Unnikrishnan Vadakkanmaruveedu, James G. Maveety |
2014-01-07 |
$13,955,000 |
| 8518750 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Devendra Natekar |
2013-08-27 |
$11,735,000 |
| 8505613 |
Die having a via filled with a heat-dissipating material |
James G. Maveety |
2013-08-13 |
$12,122,000 |
| 8409924 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Devendra Natekar |
2013-04-02 |
$10,070,000 |
| 8404519 |
Process that includes assembling together first and second substrates the have respective first and second carbon nanotube arrays with geometrically complementary patterns |
Thomas Dory, James G. Maveety, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu |
2013-03-26 |
$14,049,000 |
| 8333569 |
Method and apparatus for two-phase start-up operation |
Ioan Sauciuc |
2012-12-18 |
$29,596,000 |
| 8313282 |
Compact air-plus-liquid thermal management module |
Yousef Jarrah, Patrick D. Harper, Shen Zhao, Glen Meadows, Christopher Best +2 more |
2012-11-20 |
|
| 8227907 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Devendra Natekar |
2012-07-24 |
$18,521,000 |
| 8209989 |
Microarchitecture control for thermoelectric cooling |
Pedro Chaparro Monferrer, Jose Gonzalez |
2012-07-03 |
$15,024,000 |
| 8164169 |
Cooling devices in semiconductor packages |
Tony A. Opheim |
2012-04-24 |
$30,122,000 |
| 8125075 |
Carbon nanotube micro-chimney and thermo siphon die-level cooling |
James G. Maveety, Unnikrishnan Vadakkanmaruveedu |
2012-02-28 |
$20,590,000 |
| 8006747 |
Micro-chimney and thermosiphon die-level cooling |
James G. Maveety |
2011-08-30 |
$23,929,000 |
| 7964447 |
Process of making carbon nanotube array that includes impregnating the carbon nanotube array with metal |
Thomas Dory, James G. Maveety, Edward R. Prack, Unnikrishnan Vadakkanmaruveedu |
2011-06-21 |
$21,235,000 |
| 7915081 |
Flexible interconnect pattern on semiconductor package |
Yoshihiro Tomita, David Chau, Devendra Natekar |
2011-03-29 |
$16,404,000 |
| 7911052 |
Nanotube based vapor chamber for die level cooling |
Unnikrishnan Vadakkanmaruveedu, James G. Maveety |
2011-03-22 |
$14,593,000 |
| 7851905 |
Microelectronic package and method of cooling an interconnect feature in same |
Ravi Mahajan, Chia-Pin Chiu |
2010-12-14 |
$13,117,000 |
| 7825503 |
Covered devices in a semiconductor package |
Tony A. Opheim |
2010-11-02 |
$10,795,000 |
| 7795711 |
Microelectronic cooling apparatus and associated method |
Ioan Sauciuc |
2010-09-14 |
$15,475,000 |
| 7779638 |
Localized microelectronic cooling apparatuses and associated methods and systems |
Ioan Sauciuc |
2010-08-24 |
$13,244,000 |
| 7713839 |
Diamond substrate formation for electronic assemblies |
Chuan Hu, Daoqiang Lu |
2010-05-11 |
$17,259,000 |
| 7633753 |
Piezoelectric air jet augmented cooling for electronic devices |
Ioan Sauciuc, Hakan Erturk |
2009-12-15 |
$24,562,000 |
| 7622327 |
Covered devices in a semiconductor package |
Tony A. Opheim |
2009-11-24 |
$18,529,000 |
| 7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
Shriram Ramanathan, Steven Towle |
2009-09-15 |
$19,566,000 |
