Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8518750 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, Gregory M. Chrysler, Devendra Natekar | 2013-08-27 |
| 8409924 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, Gregory M. Chrysler, Devendra Natekar | 2013-04-02 |
| 8227907 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, Gregory M. Chrysler, Devendra Natekar | 2012-07-24 |
| 7915081 | Flexible interconnect pattern on semiconductor package | Yoshihiro Tomita, Gregory M. Chrysler, Devendra Natekar | 2011-03-29 |
| 7739876 | Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator | Ashish Gupta | 2010-06-22 |
| 7560640 | Densely packed thermoelectric cooler | Chuan Hu | 2009-07-14 |
| 7430870 | Localized microelectronic cooling | Gregory M. Chrysler | 2008-10-07 |
| 7336487 | Cold plate and mating manifold plate for IC device cooling system enabling the shipment of cooling system pre-charged with liquid coolant | Gregory M. Chrysler, Paul J. Gwin | 2008-02-26 |
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction | Shriram Ramanathan, Gregory M. Chrysler, Ryan Lei | 2007-05-01 |
| 6868898 | Heat pipe having an inner retaining wall for wicking components | Ioan Sauciuc | 2005-03-22 |