Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7279369 | Germanium on insulator fabrication via epitaxial germanium bonding | Mohamad A. Shaheen | 2007-10-09 | $11,205,000 |
| 7211890 | Integrating thermoelectric elements into wafer for heat extraction | Shriram Ramanathan, Gregory M. Chrysler, David Chau | 2007-05-01 | $14,206,000 |
| 7161224 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process | Peter G. Tolchinsky, Mohamad A. Shaheen, Irwin Yablok | 2007-01-09 | $12,865,000 |
| 7148122 | Bonding of substrates | Mohamad A. Shaheen, Maxim Kelman | 2006-12-12 | $16,980,000 |
| 6908027 | Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process | Peter G. Tolchinsky, Mohamad A. Shaheen, Irwin Yablok | 2005-06-21 | $21,477,000 |
| 6833195 | Low temperature germanium transfer | Mohamad A. Shaheen | 2004-12-21 | $44,553,000 |