| 10879134 |
Techniques for monolithic co-integration of silicon and III-N semiconductor transistors |
Marko Radosavljevic, Han Wui Then, Sansaptak Dasgupta |
2020-12-29 |
$24,597,000 |
| 10692839 |
GaN devices on engineered silicon substrates |
Sansaptak Dasgupta, Han Wui Then, Marko Radosavljevic, Robert S. Chau |
2020-06-23 |
$27,746,000 |
| 10600787 |
Silicon PMOS with gallium nitride NMOS for voltage regulation |
Sansaptak Dasgupta, Han Wui Then, Marko Radosavljevic, Roza Kotlyar, Valluri Rao |
2020-03-24 |
$21,125,000 |
| 9711591 |
Methods of forming hetero-layers with reduced surface roughness and bulk defect density of non-native surfaces and the structures formed thereby |
Niloy Mukherjee, Matthew V. Metz, James M. Powers, Van H. Le, Benjamin Chu-Kung +6 more |
2017-07-18 |
$6,909,000 |
| 9691843 |
Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition |
Annalisa Cappellani, Kelin J. Kuhn, Glenn A. Glass, Van H. Le |
2017-06-27 |
$7,334,000 |
| 9691632 |
Epitaxial wafer and a method of manufacturing thereof |
Peter Storck, Norbert Werner, Martin Vorderwestner, Irwin Yablok |
2017-06-27 |
|
| 9559160 |
Common-substrate semiconductor devices having nanowires or semiconductor bodies with differing material orientation or composition |
Annalisa Cappellani, Kelin J. Kuhn, Glenn A. Glass, Van H. Le |
2017-01-31 |
$9,360,000 |
| 8617945 |
Stacking fault and twin blocking barrier for integrating III-V on Si |
Mantu K. Hudait, Mohamad A. Shaheen, Loren A. Chow, Joel M. Fastenau, Dmitri Loubychev +1 more |
2013-12-31 |
$14,080,000 |
| 8217383 |
High hole mobility p-channel Ge transistor structure on Si substrate |
Mantu K. Hudait, Suman Datta, Jack T. Kavalieros |
2012-07-10 |
$16,128,000 |
| 8143646 |
Stacking fault and twin blocking barrier for integrating III-V on Si |
Mantu K. Hudait, Mohamad A. Shaheen, Loren A. Chow, Joel M. Fastenau, Dmitri Loubychev +1 more |
2012-03-27 |
$20,416,000 |
| 7863710 |
Dislocation removal from a group III-V film grown on a semiconductor substrate |
Mantu K. Hudait, Jack T. Kavalieros, Marko Radosavljevic |
2011-01-04 |
$17,767,000 |
| 7851781 |
Buffer layers for device isolation of devices grown on silicon |
Mantu K. Hudait, Mohamad A. Shaheen, Loren A. Chow, Joel M. Fastenau, Dmitri Loubychev +1 more |
2010-12-14 |
$13,117,000 |
| 7791063 |
High hole mobility p-channel Ge transistor structure on Si substrate |
Mantu K. Hudait, Suman Datta, Jack T. Kavalieros |
2010-09-07 |
$9,640,000 |
| 7687799 |
Methods of forming buffer layer architecture on silicon and structures formed thereby |
Mantu K. Hudait, Loren A. Chow, Dmitri Loubychev, Joel M. Fastenau, Amy W. K. Liu |
2010-03-30 |
$14,203,000 |
| 7670928 |
Ultra-thin oxide bonding for S1 to S1 dual orientation bonding |
Mohamad A. Shaheen, Willy Rachmady |
2010-03-02 |
$14,883,000 |
| 7573059 |
Dislocation-free InSb quantum well structure on Si using novel buffer architecture |
Mantu K. Hudait, Mohamad A. Shaheen, Loren A. Chow, Dmitri Loubychev, Joel M. Fastenau +1 more |
2009-08-11 |
$32,202,000 |
| 7569857 |
Dual crystal orientation circuit devices on the same substrate |
Mohamad A. Shaheen, Jack T. Kavalieros, Brian S. Doyle, Suman Datta |
2009-08-04 |
$15,097,000 |
| 7531429 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Irwin Yablok, Chuan Hu, Richard Emery |
2009-05-12 |
$14,965,000 |
| 7494911 |
Buffer layers for device isolation of devices grown on silicon |
Mantu K. Hudait, Mohamad A. Shaheen, Loren A. Chow, Joel M. Fastenau, Dmitri Loubychev +1 more |
2009-02-24 |
$15,365,000 |
| 7491988 |
Transistors with increased mobility in the channel zone and method of fabrication |
Mark Bohr, Irwin Yablok |
2009-02-17 |
$14,413,000 |
| 7473614 |
Method for manufacturing a silicon-on-insulator (SOI) wafer with an etch stop layer |
Martin D. Giles, Michael L. McSwiney, Mohamad A. Shaheen, Irwin Yablok |
2009-01-06 |
$21,219,000 |
| 7378331 |
Methods of vertically stacking wafers using porous silicon |
Mohamad A. Shaheen, Irwin Yablok, Scott R. List |
2008-05-27 |
$24,811,000 |
| 7161224 |
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process |
Mohamad A. Shaheen, Ryan Lei, Irwin Yablok |
2007-01-09 |
$12,865,000 |
| 7091108 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Irwin Yablok, Chuan Hu, Richard Emery |
2006-08-15 |
$13,533,000 |
| 7042009 |
High mobility tri-gate devices and methods of fabrication |
Mohamad A. Shaheen, Brian S. Doyle, Suman Dutta, Robert S. Chau |
2006-05-09 |
$14,660,000 |
