| 9691632 |
Epitaxial wafer and a method of manufacturing thereof |
Peter Storck, Norbert Werner, Martin Vorderwestner, Peter G. Tolchinsky |
2017-06-27 |
| 7531429 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Peter G. Tolchinsky, Chuan Hu, Richard Emery |
2009-05-12 |
| 7491988 |
Transistors with increased mobility in the channel zone and method of fabrication |
Peter G. Tolchinsky, Mark Bohr |
2009-02-17 |
| 7473614 |
Method for manufacturing a silicon-on-insulator (SOI) wafer with an etch stop layer |
Peter G. Tolchinsky, Martin D. Giles, Michael L. McSwiney, Mohamad A. Shaheen |
2009-01-06 |
| 7378331 |
Methods of vertically stacking wafers using porous silicon |
Mohamad A. Shaheen, Peter G. Tolchinsky, Scott R. List |
2008-05-27 |
| 7161224 |
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process |
Peter G. Tolchinsky, Mohamad A. Shaheen, Ryan Lei |
2007-01-09 |
| 7091108 |
Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices |
Peter G. Tolchinsky, Chuan Hu, Richard Emery |
2006-08-15 |
| 6924543 |
Method for making a semiconductor device having increased carrier mobility |
Peter G. Tolchinsky |
2005-08-02 |
| 6911380 |
Method of forming silicon on insulator wafers |
Peter G. Tolchinsky, Mohamad A. Shaheen |
2005-06-28 |
| 6908027 |
Complete device layer transfer without edge exclusion via direct wafer bonding and constrained bond-strengthening process |
Peter G. Tolchinsky, Mohamad A. Shaheen, Ryan Lei |
2005-06-21 |