Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

Methods and apparatuses for manufacturing ultra thin device layers for integrated circuit devices

US Patent 7091108 · Granted Aug 15, 2006

Estimated economic value: $13,533,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Substrate bonding method2025
Filter radio frequency module packaging structure and method for manufacturing s2024
Chip interconnection package structure and method2024
Chip stack packaging structure and chip stack packaging method2024
Network accuracy quantification method and system, device, electronic device and2023
Packaging method and package structure for filter chip2023
Neural network mapping method and apparatus2023
Fan-out packaging method and fan-out packaging plate2023
Touch control substrate and preparation method thereof, touch control module and2023
Method and device for controlling storage format of on-chip storage resource2022
Spotlight lamp with snap-fit anti-glare ring2022
Integrated circuit packaging method and integrated packaging circuit2022